Opis :

  - IOPS Intensive Application
  - Database Application
  - Hyperconverged Infrastructure

1. Dual Socket P (LGA 3647) support
    2nd Gen. Intel® Xeon® Scalable
    processors (Cascade Lake/Skylake)‡
2. 24 DIMMs; up to 6TB 3DS ECC
    DDR4-2933MHz† RDIMM/LRDIMM,
    Supports Intel® Optane™ DCPMM††
3. 2 PCI-E 3.0 x16 (FHHL) slots,
    1 PCI-E 3.0 x4 (LP) slot
4. 32 Hot-swap PCI-E EDSFF-S drive slots
5. 2x 10GBase-T LAN ports via Intel X550
6. 8x 40x56mm counter-rotation PWM fan
7. 1600W Redundant Power Supplies
    Titanium Level (96%)

Opis :

  - Corporate Database
  - Database Processing & Storage
  - Enterprise Server
  - HPC, Data Center
  - iSCSI SAN

1. Dual Socket P (LGA 3647) support
    2nd Gen. Intel® Xeon® Scalable
    processors (Cascade Lake/Skylake)‡
2. 16 DIMMs; up to 4TB 3DS ECC
    DDR4-2933MHz† RDIMM/LRDIMM,
    Supports Intel® Optane™ DCPMM††
3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8
    (slot 2 & 3 occupied by controller
    and JBOD expansion port)
4. 12 Hot-swap 3.5" SAS3/SATA3 drive
    bays including 4 optional NVMe
    drives; 2 hot-swap 2.5" SATA3
    drive bays (rear), 2 M.2 NVMe,
    Expander based backplane
5. Broadcom 3108 SAS3 AOC
6. 2x 10GBase-T LAN ports with
    Intel X722 + PHY Intel X557
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 3 Hot-swap 8cm redundant PWM fans
9. 1200W Redundant Power Supplies
    Titanium Level (96%)

Opis :

  - Corporate Database
  - Database Processing & Storage
  - Enterprise Server
  - HPC, Data Center
  - iSCSI SAN

1. Dual Socket P (LGA 3647) support
    2nd Gen. Intel® Xeon® Scalable
    processors (Cascade Lake/Skylake)‡
2. 16 DIMMs; up to 4TB 3DS ECC
    DDR4-2933MHz† RDIMM/LRDIMM,
    Supports Intel® Optane™ DCPMM††
3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8
    (slot 2 & 3 occupied by controller
    and JBOD expansion port)
4. 12 Hot-swap 3.5" SAS3/SATA3 drive
    bays including 4 optional NVMe
    drives; 2 hot-swap 2.5" SATA3
    drive bays (rear), 2 M.2 NVMe,
    Expander based backplane
5. Broadcom 3008 SAS3 AOC
6. 2x 10GBase-T LAN ports with
    Intel X722 + PHY Intel X557
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 3 Hot-swap 8cm redundant PWM fans
9. 1200W Redundant Power Supplies
    Titanium Level (96%)

Opis :

  - Corporate Database
  - Database Processing & Storage
  - Enterprise Server
  - HPC, Data Center
  - iSCSI SAN

1. Dual Socket P (LGA 3647) support
    2nd Gen. Intel® Xeon® Scalable
    processors (Cascade Lake/Skylake)‡
2. 16 DIMMs; up to 4TB 3DS ECC
    DDR4-2933MHz† RDIMM/LRDIMM,
    Supports Intel® Optane™ DCPMM††
3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8
    (slot 3 occupied by controller)
4. 12 Hot-swap 3.5" SAS3/SATA3 drive bays;
    2 hot-swap 2.5" SATA3 drive bays (rear),
    4x U.2 NVMe, 2x M.2 NVMe,
    Expander based backplane
5. Broadcom 3108 SAS3 AOC
6. 2x 10GBase-T LAN ports with
    Intel X722 + PHY Intel X557
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 3 Hot-swap 8cm redundant PWM fans
9. 1200W Redundant Power Supplies
    Titanium Level (96%)

Opis :

  - Corporate Database
  - Database Processing & Storage
  - Enterprise Server
  - HPC, Data Center
  - iSCSI SAN

1. Dual Socket P (LGA 3647) support
    2nd Gen. Intel® Xeon® Scalable
    processors (Cascade Lake/Skylake)‡
2. 16 DIMMs; up to 4TB 3DS ECC
    DDR4-2933MHz† RDIMM/LRDIMM,
    Supports Intel® Optane™ DCPMM††
3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8
    (slot 2 & 3 occupied by controller
    and JBOD expansion port)
4. 36 Hot-swap 3.5" SAS3/SATA3 drive
    bays including 4 optional NVMe
    drives; 2 hot-swap 2.5" SATA3
    drive bays (rear), 2 M.2 NVMe,
    Expander based backplane
5. Broadcom 3108 SAS3 AOC
6. 2x 10GBase-T LAN ports with
    Intel X722 + PHY Intel X557
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 7x 8cm high-performance PWM fans
9. 1200W Redundant Power Supplies
    Titanium Level (96%)

Opis :

  - Corporate Database
  - Database Processing & Storage
  - Enterprise Server
  - HPC, Data Center
  - iSCSI SAN

1. Dual Socket P (LGA 3647) support
    2nd Gen. Intel® Xeon® Scalable
    processors (Cascade Lake/Skylake)‡
2. 16 DIMMs; up to 4TB 3DS ECC
    DDR4-2933MHz† RDIMM/LRDIMM,
    Supports Intel® Optane™ DCPMM††
3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8
    (slot 2 & 3 occupied by controller
    and JBOD expansion port)
4. 36 Hot-swap 3.5" SAS3/SATA3 drive
    bays including 4 optional NVMe
    drives; 2 hot-swap 2.5" SATA3
    drive bays (rear), 2 M.2 NVMe,
    Expander based backplane
5. Broadcom 3008 SAS3 AOC
6. 2x 10GBase-T LAN ports with
    Intel X722 + PHY Intel X557
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 3 Hot-swap 8cm redundant PWM
    cooling fans, 2 hot-swap 8cm rear
    exhaust PWM fans PWM fans
9. 1200W Redundant Power Supplies
    Titanium Level (96%)

Opis :

  - High Throughput Ingest
  - High Density Hot Storage
  - HPC / Data Analytics
  - Media/Video Streaming
  - Content Delivery Network (CDN)
  - Big Data Top of Rack Storage

1. Dual Socket P (LGA 3647) support
    2nd Gen. Intel® Xeon® Scalable
    processors (Cascade Lake/Skylake)‡
2. 24 DIMMs; up to 6TB 3DS ECC
    DDR4-2933MHz† RDIMM,
    Supports Intel® Optane™ DCPMM††
3. 2 PCI-E 3.0 x16 Low-profile slots
4. Dual Drawer/Tray with a total
    of 32 NVMe 2.5" SSDs
5. 2x 10GBase-T LAN ports
6. Built in Intel QAT for Crypto/Compression
7. 8x 40x56mm PWM fans
8. 1600W Redundant Power Supplies
    Platinum Level

Opis :

  - High Throughput Ingest
  - High Density Hot Storage
  - HPC / Data Analytics
  - Media/Video Streaming
  - Content Delivery Network (CDN)
  - Big Data Top of Rack Storage

1. Dual Socket P (LGA 3647) support
    2nd Gen. Intel® Xeon® Scalable
    processors (Cascade Lake/Skylake)‡
2. 24 DIMMs; up to 6TB 3DS ECC
    DDR4-2933MHz† RDIMM,
    Supports Intel® Optane™ DCPMM††
3. 2 PCI-E 3.0 x16 Low-profile slots
4. 32 Hot-swap EDSFF Long 9.5mm drive slots
5. 2x 10GBase-T LAN ports
6. Built in Intel QAT for Crypto/Compression
7. 8x 40mm fans
8. 1600W Redundant Power Supplies
    Platinum Level

Opis :

  - IOPS Intensive Storage App.
  - Database App. (MySQL, Casandra)
  - Hyperconverged Infrastructure /
    Scale-out Architectures

1. Dual Socket P (LGA 3647) support
    2nd Gen. Intel® Xeon® Scalable
    processors (Cascade Lake/Skylake)‡
2. 24 DIMMs; up to 6TB 3DS ECC
    DDR4-2933MHz† RDIMM/LRDIMM,
    Supports Intel® Optane™ DCPMM††
3. 2 PCI-E 3.0 x16 slots,
    1 PCI-E 3.0 x4 slot
4. 32 Hot-swap PCI-E NF1 drive bays,
    4 SATA3 M.2 drive bays support M.2
    Form Factor 22x42/60/80/110
5. 2x 10GBase-T LAN ports via Intel X550
6. 8 Heavy duty 4cm counter-rotating
    fans with air shroud
7. 1600W Redundant Power Supplies
    Titanium Level (96%)

Opis :

  - Corporate Database
  - Database Processing & Storage
  - Enterprise Server
  - HPC, Data Center
  - iSCSI SAN

1. Dual Socket P (LGA 3647) support
    2nd Gen. Intel® Xeon® Scalable
    processors (Cascade Lake/Skylake)‡
2. 16 DIMMs; up to 4TB 3DS ECC
    DDR4-2933MHz† RDIMM/LRDIMM,
    Supports Intel® Optane™ DCPMM††
3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8
4. 24 Hot-swap 2.5" SAS3/SATA3
    direct attached drive bays
5. 3 Broadcom 3108 SAS3 AOC (HW RAID)
6. 2x 10GBase-T LAN ports with
    Intel X722 + PHY Intel X557
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 3 Hot-swap 8cm redundant PWM fans
9. 1200W Redundant Power Supplies
    Titanium Level (96%)

Opis :

  - Corporate Database
  - Database Processing & Storage
  - Enterprise Server
  - HPC, Data Center
  - iSCSI SAN

1. Dual Socket P (LGA 3647) support
    2nd Gen. Intel® Xeon® Scalable
    processors (Cascade Lake/Skylake)‡
2. 16 DIMMs; up to 4TB 3DS ECC
    DDR4-2933MHz† RDIMM/LRDIMM,
    Supports Intel® Optane™ DCPMM††
3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8
4. 24 Hot-swap 2.5" SAS3/SATA3
    direct attached drive bays
5. 3 Broadcom 3008 SAS3 AOC (IT mode)
6. 2x 10GBase-T LAN ports with
    Intel X722 + PHY Intel X557
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 3 Hot-swap 8cm redundant PWM fans
9. 1200W Redundant Power Supplies
    Titanium Level (96%)

Opis :

  - Object Storage/Warm Storage
  - Content Delivery Network (CDNs)
  - Multi-access Edge Computing
  - VM and SMB Servers

1. Intel® Xeon® processor D-2146NT,
    8-Core, 16 Threads, 80W
2. 12 Hot-swap 3.5" SATA3 bays;
    SAS3 and U.2 x2 supported by AOC
3. 1 PCI-E 3.0 x8 (FH) slot;
    1 M.2 slot M key and 1 B Key
4. Up to 512GB ECC LRDIMM,
    up to 256GB reg. ECC RDIMM
    DDR4-2133Mz; in 4 DIMM slots
5. 4x 1GbE, 2x 10GBase-T, 2x 10G SFP+
    and 1 dedicated LAN for IPMI 2.0
6. 1 VGA, 2 USB 3.0
7. 6x 4cm 4-pin PWM fans
8. 400W Redundant Power Supplies
    Platinum Level (94%)
9. Built in Intel QAT up to 40Gbps
    Crypto/Compression

Opis :

• High Density Storage
• Object Storage 1U
• Scale-out Storage
• Ceph / Hadoop
• Big Data Analytics
1. Dual Socket P (LGA 3647) support
    2nd Gen. Intel® Xeon® Scalable
    processors (Cascade Lake/Skylake)‡
2. 12 DIMMs; up to 3TB 3DS ECC
    DDR4-2933MHz† RDIMM/LRDIMM,
    Supports Intel® Optane™ DCPMM††
3. 2 PCI-E 3.0 x16 slots,
    1 PCI-E 3.0 x8 LP slot,
    1 PCI-E 3.0 x4 NVMe M.2 slot
4. 12 Hot-swap 3.5" SAS3/SATA3, 4 Hot-
    swap 2.5" 7mm NVMe/SATA drive bays
5. 2x 10GBase-T ports via Intel C622
6. IPMI 2.0 + KVM with Dedicated LAN
7. 1 VGA, 4 USB 3.0 (rear)
8. Internal Cable Arm
9. 600W Redundant Power Supplies
    Platinum Level Certified

Opis :

Two hot-pluggable
1. Dual Socket P (LGA 3647) support
    2nd Gen. Intel® Xeon® Scalable
    processors (Cascade Lake/Skylake)‡
2. 12 DIMMs; up to 3TB 3DS ECC
    DDR4-2933MHz† RDIMM/LRDIMM,
    Supports Intel® Optane™ DCPMM††
3. 24 U.2 Hot-swap dual-port NVMe
    drive bays
4. 2 PCI-E 3.0 x16 HHHL slots,
    1 PCI-E 3.0 x16 SIOM
5. Dedicated node to node connectivity
    featuring high performance PLX NTB
    PCI-E 3.0 x8 and IPMI for robust
    node fail-over support
6. Dual port 10GBase-T (Intel® X557-AT2),
    Dual 10G private ethernet between
    controller nodes
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 5x 8cm high-performance PWM fans
9. 2000W Redundant Power Supplies
    Titanium Level (96%)

Opis :

  - Corporate Database
  - Database Processing & Storage
  - Enterprise Server
  - HPC, Data Center
  - iSCSI SAN

1. Dual Socket P (LGA 3647) support
    2nd Gen. Intel® Xeon® Scalable
    processors (Cascade Lake/Skylake)‡
2. 16 DIMMs; up to 4TB 3DS ECC
    DDR4-2933MHz† RDIMM/LRDIMM,
    Supports Intel® Optane™ DCPMM††
3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8
    (slot 2 & 3 occupied by controller
    and JBOD expansion port)
4. 24 Hot-swap 2.5" SAS3/SATA3 drive bays;
    2 Hot-swap 2.5" SATA3 drive bays (rear)
    Expander based backplane
5. Broadcom 3108 SAS3 AOC
6. 2x 10GBase-T LAN ports with
    Intel X722 + PHY Intel X557
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 3 Hot-swap 8cm redundant PWM fans
9. 1200W Redundant Power Supplies
    Titanium Level (96%)

Opis :

  - Corporate Database
  - Database Processing & Storage
  - Enterprise Server
  - HPC, Data Center
  - iSCSI SAN

1. Dual Socket P (LGA 3647) support
    2nd Gen. Intel® Xeon® Scalable
    processors (Cascade Lake/Skylake)‡
2. 16 DIMMs; up to 4TB 3DS ECC
    DDR4-2933MHz† RDIMM/LRDIMM,
    Supports Intel® Optane™ DCPMM††
3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8
    (slot 2 & 3 occupied by controller
    and JBOD expansion port)
4. 24 Hot-swap 2.5" SAS3/SATA3 drive bays;
    2 Hot-swap 2.5" SATA3 drive bays (rear)
    Expander based backplane
5. Broadcom 3008 SAS3 AOC
6. 2x 10GBase-T LAN ports with
    Intel X722 + PHY Intel X557
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 3 Hot-swap 8cm redundant PWM fans
9. 1200W Redundant Power Supplies
    Titanium Level (96%)

Opis :

• Backup Storage, Cold Storage
• Database Applications
• Data Warehousing, Archiving
1. Single Socket P (LGA 3647) supports
    2nd Gen. Intel® Xeon® Scalable
    processor (Cascade Lake/Skylake)‡
2. 8 DIMMs; up to 2TB 3DS ECC
    DDR4-2933MHz† RDIMM/LRDIMM,
    Supports Intel® Optane™ DCPMM††
3. 2 PCI-E 3.0 x8 (in x16),
    3 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8)
    1 PCI-E 3.0 x8 (occupied by HBA)
4. 2 GbE LAN ports via Intel i210
5. 45 Hot-swap 3.5" SAS3/SATA3 drive
    bays, 2 rear Hot-swap 2.5" SATA
    drive bays; optional 2 SATA or NVMe
6. Broadcom 3108 SAS3, HW RAID
    (AOC-S3108L-H8IR-P )
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 5 Hot-swap 8cm redundant PWM fans
9. 1600W Redundant Power Supplies
    Platinum Level

Opis :

• Backup Storage, Cold Storage
• Database Applications
• Data Warehousing, Archiving
1. Single Socket P (LGA 3647) supports
    2nd Gen. Intel® Xeon® Scalable
    processor (Cascade Lake/Skylake)‡
2. 8 DIMMs; up to 2TB 3DS ECC
    DDR4-2933MHz† RDIMM/LRDIMM,
    Supports Intel® Optane™ DCPMM††
3. 2 PCI-E 3.0 x8 (in x16),
    3 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8)
    1 PCI-E 3.0 x8 (occupied by HBA)
4. 2 GbE LAN ports via Intel i210
5. 45 Hot-swap 3.5" SAS3/SATA3 drive
    bays, 2 rear Hot-swap 2.5" SATA
    drive bays; optional 2 SATA or NVMe
6. Broadcom 3008 SAS3 IT mode
    (AOC-S3008L-L8E)
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 5 Hot-swap 8cm redundant PWM fans
9. 1600W Redundant Power Supplies
    Platinum Level

Opis :

• High Density Storage
• Object Storage 1U
• Scale-out Storage
• Ceph / Hadoop
• Big Data Analytics
1. Dual Socket P (LGA 3647) support
    2nd Gen. Intel® Xeon® Scalable
    processors (Cascade Lake/Skylake)‡
2. 12 DIMMs; up to 3TB 3DS ECC
    DDR4-2933MHz† RDIMM/LRDIMM,
    Supports Intel® Optane™ DCPMM††
3. 2 PCI-E 3.0 x16 slots,
    1 PCI-E 3.0 x8 LP slot,
    1 PCI-E 3.0 x4 NVMe M.2 slot
4. 12 Hot-swap 3.5" SAS3/SATA3, 4 Hot-
    swap 2.5" 7mm NVMe/SATA drive bays
5. 2x 10GBase-T ports via Intel C622
6. IPMI 2.0 + KVM with Dedicated LAN
7. 1 VGA, 4 USB 3.0 (rear)
8. Internal Cable Arm
9. 800W Redundant Power Supplies
    Platinum Level Certified

Opis :

  - Corporate Database
  - Database Processing & Storage
  - Enterprise Server
  - HPC, Data Center
  - iSCSI SAN

1. Dual Socket P (LGA 3647) support
    2nd Gen. Intel® Xeon® Scalable
    processors (Cascade Lake/Skylake)‡
2. 16 DIMMs; up to 4TB 3DS ECC
    DDR4-2933MHz† RDIMM/LRDIMM,
    Supports Intel® Optane™ DCPMM††
3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8
    (slot 3 occupied by controller)
16 Hot-swap 3.5" SAS3/SATA3 drive
    bays including 4 optional NVMe
    drives; 2 hot-swap 2.5" SATA3
    drive bays (rear), 2 M.2 NVMe,
    Expander based backplane
5. Broadcom 3108 SAS3 AOC
6. 2x 10GBase-T LAN ports with
    Intel X722 + PHY Intel X557
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 3 Hot-swap 8cm redundant PWM fans
9. 1600W Redundant Power Supplies
    Titanium Level (96%)

Opis :

  - Corporate Database
  - Database Processing & Storage
  - Enterprise Server
  - HPC, Data Center
  - iSCSI SAN

1. Dual Socket P (LGA 3647) support
    2nd Gen. Intel® Xeon® Scalable
    processors (Cascade Lake/Skylake)‡
2. 16 DIMMs; up to 4TB 3DS ECC
    DDR4-2933MHz† RDIMM/LRDIMM,
    Supports Intel® Optane™ DCPMM††
3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8
    (slot 2 & 3 occupied by controller
    and JBOD expansion port)
4. 16 Hot-swap 3.5" SAS3/SATA3
    drive bays; 2 hot-swap 2.5"
    SATA3 drive bays (rear),
    2 M.2 NVMe,
    Expander based backplane
5. Broadcom 3108 SAS3 AOC
6. 2x 10GBase-T LAN ports with
    Intel X722 + PHY Intel X557
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 3 Hot-swap 8cm redundant PWM
    cooling fans, 2 hot-swap 8cm rear
    exhaust PWM fans PWM fans
9. 1200W Redundant Power Supplies
    Titanium Level (96%)

Opis :

  - Corporate Database
  - Database Processing & Storage
  - Enterprise Server
  - HPC, Data Center
  - iSCSI SAN

1. Dual Socket P (LGA 3647) support
    2nd Gen. Intel® Xeon® Scalable
    processors (Cascade Lake/Skylake)‡
2. 16 DIMMs; up to 4TB 3DS ECC
    DDR4-2933MHz† RDIMM/LRDIMM,
    Supports Intel® Optane™ DCPMM††
3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8
    (slot 2 & 3 occupied by controller
    and JBOD expansion port)
4. 16 Hot-swap 3.5" SAS3/SATA3
    drive bays; 2 hot-swap 2.5"
    SATA3 drive bays (rear),
    2 M.2 NVMe,
    Expander based backplane
5. Broadcom 3008 SAS3 AOC
6. 2x 10GBase-T LAN ports with
    Intel X722 + PHY Intel X557
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 3 Hot-swap 8cm redundant PWM
    cooling fans, 2 hot-swap 8cm rear
    exhaust PWM fans PWM fans
9. 1200W Redundant Power Supplies
    Titanium Level (96%)

Opis :

  - Corporate Database
  - Database Processing & Storage
  - Enterprise Server
  - HPC, Data Center
  - iSCSI SAN

1. Dual Socket P (LGA 3647) support
    2nd Gen. Intel® Xeon® Scalable
    processors (Cascade Lake/Skylake)‡
2. 16 DIMMs; up to 4TB 3DS ECC
    DDR4-2933MHz† RDIMM/LRDIMM,
    Supports Intel® Optane™ DCPMM††
3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8
    (slot 2 & 3 occupied by controller
    and JBOD expansion port)
4. 24 Hot-swap 3.5" SAS3/SATA3
    drive bays; 2 hot-swap 2.5"
    SATA3 drive bays (rear),
    2 M.2 NVMe,
    Expander based backplane
5. Broadcom 3108 SAS3 AOC
6. 2x 10GBase-T LAN ports with
    Intel X722 + PHY Intel X557
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 3 Hot-swap 8cm redundant PWM
    cooling fans, 2 hot-swap 8cm rear
    exhaust PWM fans PWM fans
9. 1200W Redundant Power Supplies
    Titanium Level (96%)

Opis :

  - Corporate Database
  - Database Processing & Storage
  - Enterprise Server
  - HPC, Data Center
  - iSCSI SAN

1. Dual Socket P (LGA 3647) support
    2nd Gen. Intel® Xeon® Scalable
    processors (Cascade Lake/Skylake)‡
2. 16 DIMMs; up to 4TB 3DS ECC
    DDR4-2933MHz† RDIMM/LRDIMM,
    Supports Intel® Optane™ DCPMM††
3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8
    (slot 2 & 3 occupied by controller
    and JBOD expansion port)
4. 24 Hot-swap 3.5" SAS3/SATA3
    drive bays; 2 hot-swap 2.5"
    SATA3 drive bays (rear),
    2 M.2 NVMe,
    Expander based backplane
5. Broadcom 3008 SAS3 AOC
6. 2x 10GBase-T LAN ports with
    Intel X722 + PHY Intel X557
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 3 Hot-swap 8cm redundant PWM
    cooling fans, 2 hot-swap 8cm rear
    exhaust PWM fans PWM fans
9. 1200W Redundant Power Supplies
    Titanium Level (96%)

Opis :

• Application and data serving
• Connectivity/Storage Compute
    Nodes
• High Availability Storage
    Appliance Platform
1. Single Socket P (LGA 3647) supports
    2nd Gen. Intel® Xeon® Scalable
    processor (Cascade Lake/Skylake)‡
2. 8 DIMMs; up to 2TB 3DS ECC
    DDR4-2933MHz† RDIMM/LRDIMM,
    Supports Intel® Optane™ DCPMM††
3. 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8,
    1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8)
4. 2x 10GBase-T with Intel® X557
5. 12 Hot-swap 3.5" SAS/SATA drive bays
    with SES3; 2 Hot-swap 2.5" NVMe/SATA
    (rear, optional)
6. SAS3 via Broadcom 3008 controller
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 3 High-performance 80mm PWM fans
9. 800W Redundant Power Supplies
    Titanium Level (96%)

Opis :

• Connectivity/Storage Compute
    Nodes
• Database Processing & Storage
    Appliance Platform
1. Single Socket P (LGA 3647) supports
    2nd Gen. Intel® Xeon® Scalable
    processor (Cascade Lake/Skylake)‡
2. 8 DIMMs; up to 2TB 3DS ECC
    DDR4-2933MHz† RDIMM/LRDIMM,
    Supports Intel® Optane™ DCPMM††
3. 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8,
    1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8)
4. 2x 10GBase-T with Intel® X557
5. 36 Hot-swap 3.5" SAS/SATA drive bays
    with SES3 (24 front + 12 rear);
    4 Internal fixed 2.5" drive bays
    2 Hot-swap 2.5" NVMe/SATA
    (rear, optional)
6. SAS3 via Broadcom 3008 controller
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 7 High-performance 8cm PWM fans
9. 1200W Redundant Power Supplies
    Titanium Level (96%)

Opis :

1. Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 3TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 24 DIMM slots
3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8
4. SIOM for flexible networking options
5. 48 Hot-swap 2.5" NVMe drive bays;
    2 rear Hot-swap 2.5" SATA drive bays
6. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
7. 5 Hot-swap 8cm redundant PWM fans
8. 1600W Redundant Power Supplies
    Titanium Level (96%)
(Simply Double)

Opis :

1. Single socket FCBGA 1283 supports
    Intel® Atom® processor C2750
2. System on Chip
3. 12x 3.5" Hot-swap HDD bays
4. Up to 64GB Unbuffered ECC/non-ECC
    DDR3 1600MHz in 4x DIMM slots
5. 1x PCI-E 2.0 x4 (in x8, LP, HL)
6. Dual GbE LAN ports with SoC
7. Integrated IPMI 2.0 and KVM with
    Dedicated LAN
8. I/O ports: IPMI, 2x GbE, VGA
9. 400W High-efficiency redundant
    short depth Power Supplies

Opis :

1. Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 2TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 16x DIMM slots
3. 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8
    (slot 1-3 occupied by controllers
4. Dual 10GBase-T LAN w/ Intel® X540
5. 24 Hot-swap 2.5" SAS3/SATA3
    direct attached drive bays;
    2 optional hot-swap 2.5"
    SATA drive bays (rear)
6. SAS3 via 3 Broadcom 3108 AOC (HW RAID)
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 3 Hot-swap 8cm redundant PWM fans
9. 920W Redundant Power Supplies
    Platinum Level (94%)

Opis :

1. Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 2TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 16x DIMM slots
3. 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8
    (slot 1-3 occupied by controllers)
4. Dual 10GBase-T LAN w/ Intel® X540
5. 24 Hot-swap 2.5" SAS3/SATA3
    direct attached drive bays;
    2 optional hot-swap 2.5"
    SATA drive bays (rear)
6. SAS3 via 3 Broadcom 3008 controller; IT mode
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 3 Hot-swap 8cm redundant PWM fans
9. 920W Redundant Power Supplies
    Platinum Level (94%)

Opis :

• Cold Storage
• Data Warehousing, Archiving
• Long Tail, Medical Records, Compliance Docs
• Low Power Efficiency Appliance
1. Intel® Pentium® processor D1508,
    Single socket FCBGA 1667;
    2-Core, 4 Threads, 25W
2. 12x 3.5" SAS2/SATA3 Hot-swap
    HDD bays
3. Expansion slot: 1x PCI-E 3.0 x8,
    M.2 PCIe 3.0 x4, M Key 2242/2280/
    22110, Mini-PCIe w/ mSATA support
4. Up to 128GB ECC RDIMM DDR4
    1866MHz or 64GB ECC/non-ECC
    UDIMM in 4 sockets
5. Dual 10G SFP+ and dual 1GbE LAN
6. 2x USB 3.0 ports (rear), 5x USB
    2.0 ports (4 via headers, 1 Type A)
7. 5x 4cm middle fans
8. 400W High-efficiency redundant
    short depth Power Supplies

Opis :

• Cold Storage
• Archiving, Mail/Finance, Security
• Scale-Out Density, VOD Delivery
• Low Power Efficiency Appliance
1. Intel® Xeon® processor D-1518,
    Single socket FCBGA 1667;
    4-Core, 8 Threads, 35W
2. 12x 3.5" SAS2/SATA3 Hot-swap
    HDD bays
3. Expansion slot: 1x PCI-E 3.0 x8,
    M.2 PCIe 3.0 x4, M Key 2242/2280/
    22110, Mini-PCIe w/ mSATA support
4. Up to 128GB ECC RDIMM DDR4
    2133MHz or 64GB ECC/non-ECC
    UDIMM in 4 sockets
5. Dual 10G SFP+ and dual 1GbE LAN
6. 2x USB 3.0 ports (rear), 5x USB
    2.0 ports (4 via headers, 1 Type A)
7. 5x 4cm middle fans
8. 400W High-efficiency redundant
    short depth Power Supplies

Opis :

• Warm Storage
• CDN, Business Hosting
• OLTP/DB
• Low power efficiency appliance
1. Intel® Xeon® processor D-1537,
    Single socket FCBGA 1667;
    8-Core, 16 Threads, 35W
2. 12x 3.5" SAS2/SATA3 Hot-swap
    HDD bays
3. Expansion slot: 1x PCI-E 3.0 x8,
    M.2 PCIe 3.0 x4, M Key 2242/2280/
    22110, Mini-PCIe w/ mSATA support
4. Up to 128GB ECC RDIMM DDR4
    2133MHz or 64GB ECC/non-ECC
    UDIMM in 4 sockets
5. Dual 10G SFP+ and dual 1GbE LAN
6. 2x USB 3.0 ports (rear), 5x USB
    2.0 ports (4 via headers, 1 Type A)
7. 5x 4cm middle fans
8. 400W High-efficiency redundant
    short depth Power Supplies

Opis :

Two hot-pluggable
1. Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 2TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 16 DIMM slots
3. 1 PCI-E 3.0 x16 HHHL slot, 1 PCI-E 3.0
    x8 HHHL slot, 1 SIOM slot
4. Dual port 10GBase-T (Intel® X540),
    Intel® XL710 used for dedicated
    heartbeat between 2 nodes in SBB
5. 24 Hot-swap 2.5" dual port NVMe
    drive bays
6. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
7. 5 high-performance 8cm PWM fans
8. 2000W Redundant Power Supplies
    Titanium Level (96%)

Opis :

Two hot-pluggable
1. Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 2TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 16 DIMM slots
3. 1 PCI-E 3.0 x16 HHHL slot, 1 PCI-E 3.0
    x8 HHHL slot, 1 SIOM slot
4. Dual port 10GBase-T (Intel® X540),
    Intel® XL710 used for dedicated
    heartbeat between 2 nodes in SBB
5. 48 Hot-swap 2.5" dual port NVMe
    drive bays
6. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
7. 5 high-performance 8cm PWM fans
8. 2000W Redundant Power Supplies
    Titanium Level (96%)

Opis :

1. Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 2TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 16x DIMM slots
3. 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8
    (slot 1 & 2 occupied by controller
    and JBOD expansion port)
4. Dual 10GBase-T LAN w/ Intel® X540
5. 24 Hot-swap 2.5" drive bays,
    2 optional Hot-swap 2.5"
    SATA drive bays (rear)
6. SAS3 via Broadcom 3108 AOC (HW RAID)
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 3 Hot-swap 8cm redundant PWM fans
9. 920W Redundant Power Supplies
    Platinum Level (94%)

Opis :

1. Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 2TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 16x DIMM slots
3. 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8
    (slot 1 & 2 occupied by controller
    and JBOD expansion port)
4. Dual 10GBase-T LAN w/ Intel® X540
5. 24 Hot-swap 2.5" drive bays,
    2 optional Hot-swap 2.5"
    SATA drive bays (rear)
6. SAS3 via Broadcom 3008 controller; IT mode
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 3 Hot-swap 8cm redundant PWM fans
9. 920W Redundant Power Supplies
    Platinum Level (94%)

Opis :

1. Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 3TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 24x DIMM slots
3. 2 PCI-E 3.0 x16, 3 PCI-E 3.0 x8, 1 PCI-E
    2.0 x4 (in x8); Slot 1 & 2 occupied by
    controller and JBOD expansion port)
4. Quad LAN w/ Intel® X540 10GBase-T
5. 24 Hot-swap 2.5" SAS3/SATA3
    drive bays
6. Hardware RAID controller and JBOD
    Expansion; RAID 0, 1, 5, 6, 10, 50, 60
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 3 Hot-swap 8cm redundant PWM fans
9. 920W Redundant Power Supplies
    Platinum Level (94%)

Opis :

1. Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 3TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 24 DIMM slots
3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8
4. SIOM for flexible networking options
5. 48 Hot-swap 2.5" SAS3/SATA3
    drive bays; optional 2 Hot-swap
    2.5" rear SATA drive bays
6. Broadcom 3008 SAS3 IT mode controller
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 5 Hot-swap 8cm redundant PWM fans
9. 1600W Redundant Power Supplies
    Titanium Level (96%)
(Simply Double)

Opis :

1. Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 3TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 24 DIMM slots
3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8
4. SIOM for flexible networking options
5. 48 Hot-swap 2.5" SAS3/SATA3
    drive bays; optional 2 Hot-swap
    2.5" rear SATA drive bays
6. Onboard Broadcom 3108 SAS3 HW RAID
    RAID 0, 1, 5, 6, 10, 50, 60
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 5 Hot-swap 8cm redundant PWM fans
9. 1600W Redundant Power Supplies
    Titanium Level (96%)
(Simply Double)

Opis :

1. Single socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 1TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 8x DIMM slots
3. 1 PCI-E 3.0 x4 (in x8), 2 PCI-E 3.0 x8,
    1 PCI-E 3.0 x8 (in x16), 1 PCI-E 2.0 x2
    (in x4), 1 PCI-E 2.0 x4 (in x8)
4. Intel® i350-AM4 Quad port GbE LAN
5. 12x 3.5" Hot-swap SAS3 HDD bays;
    Opt. 2x 2.5" Hot-swap HDD bays (rear)
6. SAS3 via Broadcom 3008 controller; IR mode
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 3x 8cm high-performance PWM fans
9. 920W Redundant Power Supplies
    Platinum Level (94%)
10. Dual JBOD expansion ports

Opis :

1. Single socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 1TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 8x DIMM slots
3. 1 PCI-E 3.0 x4 (in x8), 1 PCI-E 3.0 x8
    (in x16), 2 PCI-E 3.0 x8, 1 PCI-E 2.0
    x2 (in x4), 1 PCI-E 2.0 x4 (in x8)
4. Intel® i350-AM4 Quad port GbE LAN
5. 36x 3.5" Hot-swap SAS3 HDD Bays
    (24 front + 12 rear);
    Opt. 2x 2.5" Hot-swap HDD bays (rear)
6. SAS3 via Broadcom 3008 controller; IR mode
7. Dual JBOD expansion ports
8. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
9. 7x 80mm middle cooling fans
10. 1280W Redundant Power Supplies
    Platinum Level (94%)

Opis :

1. Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 2TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 16x DIMM slots
3. 1x PCI-E 3.0 x16, 6x PCI-E 3.0 x8
    (1 & 2 occupied by controller
    and JBOD expansion port)
4. Dual 10GBase-T LAN w/ Intel® X540
5. 12x 3.5" Hot-swap drive bays:
    8x 3.5" Hot-swap SAS3/SATA3 drive
    bays and 4x NVMe hybrid drive bays
    (SAS3/SATA3/NVMe*); 2x 2.5" optional
    Hot-swap SATA drive bays (rear)
6. SAS3 via Broadcom 3108 AOC (HW RAID)
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 3x 8cm hot-swap redundant PWM
    cooling fans
9. 920W Redundant Power Supplies
    Platinum Level (94%)

Opis :

1. Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 2TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 16x DIMM slots
3. 1x PCI-E 3.0 x16, 6x PCI-E 3.0 x8
    (slot 1 & 2 occupied by controller
    and JBOD expansion port)
4. Dual 10GBase-T LAN w/ Intel® X540
5. 12x 3.5" Hot-swap drive bays:
    8x 3.5" Hot-swap SAS3/SATA3 drive
    bays and 4x NVMe hybrid drive bays
    (SAS3/SATA3/NVMe*); 2x 2.5" optional
    Hot-swap SATA drive bays (rear)
6. SAS3 via Broadcom 3008 controller; IT mode
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 3x 8cm hot-swap redundant PWM
    cooling fans
9. 920W Redundant Power Supplies
    Platinum Level (94%)

Opis :

1. Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 3TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 24x DIMM slots
3. 2 PCI-E 3.0 x16, 3 PCI-E 3.0 x8, 1 PCI-E
    2.0 x4 (in x8); Slot 3 & 1 occupied by
    controller and JBOD expansion port)
4. Quad 10GBase-T LAN w/ Intel® X540
5. 12x 3.5" Hot-swap SAS3/SATA3 drive
    bays
6. SAS3 via Broadcom 3108 AOC (HW RAID)
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 3x 8cm hot-swap redundant
    PWM cooling fans
9. 920W Redundant Power Supplies
    Platinum Level (94%)

Opis :

1. Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 2TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 16x DIMM slots
3. 1x PCI-E 3.0 x16, 6x PCI-E 3.0 x8
4. Dual 10GBase-T LAN w/ Intel® X540
5. 12x 3.5" Hot-swap SAS3/SATA3 drive
    bays; 2x 2.5" optional Hot-swap
    SATA drive bays (rear)
6. SAS3 (12Gbps) via Broadcom 3108 onboard HW RAID
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 3x 8cm hot-swap redundant PWM
    cooling fans
9. 920W Redundant Power Supplies
    Platinum Level (94%)

Opis :

1. Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 2TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 16x DIMM slots
3. 1x PCI-E 3.0 x16, 6x PCI-E 3.0 x8
4. Dual 10GBase-T LAN w/ Intel® X540
5. 16x 3.5" Hot-swap drive bays:
    12x 3.5" Hot-swap SAS3 drive bays
    and 4x NVMe hybrid drive bays
    (SAS3/SATA3/NVMe*); 2x 2.5"
    Hot-swap SATA drive bays (rear)
6. SAS3 via Broadcom 3108 controller, HW RAID
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 4x 8cm hot-swap redundant PWM
    cooling fans
9. 1000W Redundant Power Supplies
    Titanium Level

Opis :

1. Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 3TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 24x DIMM slots
3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8
4. SIOM for flexible networking options
5. 24x 3.5" Hot-swap SAS3/SATA3 drive
    bays; optional 2x 2.5" Hot-swap rear
    SATA drive bays
6. Broadcom 3008 SAS3 IT mode controller
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 5x 8cm hot-swap redundant PWM fans
9. 1600W Redundant Power Supplies
    Titanium Level (96%)

Opis :

1. Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 3TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 24x DIMM slots
3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8
4. SIOM for flexible networking options
5. 24x 3.5" Hot-swap SAS3/SATA3 drive
    bays; optional 2x 2.5" Hot-swap rear
    SATA drive bays
6. Onboard Broadcom 3108 SAS3 Hardware RAID
    RAID 0, 1, 5, 6, 10, 50, 60
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 5x 8cm hot-swap redundant PWM fans
9. 1600W Redundant Power Supplies
    Titanium Level (96%)

Opis :

1. Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 2TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 16x DIMM slots
3. 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8
    (slot 1 & 2 occupied by controller
    and JBOD expansion port)
4. Dual 10GBase-T LAN w/ Intel® X540
5. 16x 3.5" Hot-swap SAS3/SATA3 drive
    bays; 2x 2.5" optional Hot-swap
    SATA drive bays (rear)
6. SAS3 Hardware RAID controller and
    JBOD Expansion; RAID 0,1,5,6,10,50,60
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 2x 80mm hot-swap rear exhaust
    PWM fans
9. 920W Redundant Power Supplies
    Platinum Level (94%)

Opis :

1. Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 2TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 16x DIMM slots
3. 1 PCI-E 3.0 x16, 3 PCI-E 3.0 x8
    (slot 3 & 4 occupied by controller
    and JBOD expansion port)
4. Dual 10GBase-T LAN w/ Intel® X540
5. 16x 3.5" Hot-swap SAS3/SATA3 drive
    bays; 2x 2.5" optional Hot-swap
    SATA drive bays (rear)
6. SAS3 via Broadcom 3008 controller; IT mode
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 2x 80mm hot-swap rear exhaust
    PWM fans
9. 920W Redundant Power Supplies
    Platinum Level (94%)

Opis :

1. Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 3TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 24x DIMM slots
3. 2 PCI-E 3.0 x16, 3 PCI-E 3.0 x8, 1 PCI-E
    2.0 x4 (in x8); Slot 3 & 1 occupied by
    controller and JBOD expansion port)
4. Quad 10GBase-T LAN w/ Intel® X540
5. 16x 3.5" Hot-swap SAS3/SATA3 drive
    bays; 2x 2.5" optional Hot-swap
    SATA drive bays (rear)
6. Hardware RAID controller and JBOD
    Expansion; RAID 0, 1, 5, 6, 10, 50, 60
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 2x 80mm hot-swap rear exhaust
    PWM fans
9. 920W Redundant Power Supplies
    Platinum Level (94%)

Opis :

1. Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 2TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 16x DIMM slots
3. 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8
    (slot 1 & 2 occupied by controller
    and JBOD expansion port)
4. Dual 10GBase-T LAN w/ Intel® X540
5. 24x 3.5" Hot-swap SAS3 (with Broadcom
    expander) / SATA3 drive bays; 2x 2.5"
    optional Hot-swap SATA drive bays (rear)
6. SAS3 via Broadcom 3108 AOC (HW RAID)
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 2x 80mm hot-swap rear exhaust
    PWM fans
9. 920W Redundant Power Supplies
    Platinum Level (94%)

Opis :

1. Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 2TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 16x DIMM slots
3. 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8
    (slot 1 & 2 occupied by controller
    and JBOD expansion port)
4. Dual 10GBase-T LAN w/ Intel® X540
5. 24x 3.5" Hot-swap SAS3 (with Broadcom
    expander) / SATA3 drive bays; 2x 2.5"
    optional Hot-swap SATA drive bays (rear)
6. SAS3 via Broadcom 3008 controller; IT mode
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 2x 80mm hot-swap rear exhaust
    PWM fans
9. 920W Redundant Power Supplies
    Platinum Level (94%)

Opis :

1. Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 3TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 24x DIMM slots
3. 2 PCI-E 3.0 x16, 3 PCI-E 3.0 x8, 1 PCI-E
    2.0 x4 (in x8); Slot 3 & 4 occupied by
    controller and JBOD expansion port)
4. Quad 10GBase-T LAN w/ Intel® X540
5. 24x 3.5" Hot-swap SAS3 (with Broadcom
    expander) / SATA3 drive bays; 2x 2.5"
    optional Hot-swap SATA drive bays (rear)
6. SAS3 via Broadcom 3108 AOC (HW RAID)
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 2x 80mm hot-swap rear exhaust
    PWM fans
9. 920W Redundant Power Supplies
    Platinum Level (94%)

Opis :

1. Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 2TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 16x DIMM slots
3. 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8
    (slot 1 & 2 occupied by controller
    and JBOD expansion port)
4. Dual 10GBase-T LAN w/ Intel® X540
5. 36x 3.5" Hot-swap drive bays
    (24 front + 12 rear):
    32x 3.5" Hot-swap SAS3/SATA3 drive
    bays and 4x NVMe hybrid drive bays
    (SAS3/SATA3/NVMe*); 2x 2.5" optional
    Hot-swap SATA drive bays (rear);
    4x 2.5" internal fixed drive bays
6. SAS3 via Broadcom 3108 AOC (HW RAID)
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 7x 80mm middle cooling fans
9. 1280W Redundant Power Supplies
    Platinum Level (94%)

Opis :

1. Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 2TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 16x DIMM slots
3. 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8
    (slot 1 & 2 occupied by controller
    and JBOD expansion port)
4. Dual 10GBase-T LAN w/ Intel® X540
5. 36x 3.5" Hot-swap drive bays
    (24 front + 12 rear):
    32x 3.5" Hot-swap SAS3/SATA3 drive
    bays and 4x NVMe hybrid drive bays
    (SAS3/SATA3/NVMe*); 2x 2.5" optional
    Hot-swap SATA drive bays (rear);
    4x 2.5" internal fixed drive bays
6. SAS3 via Broadcom 3008 controller; IT mode
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 7x 80mm middle cooling fans
9. 1280W Redundant Power Supplies
    Platinum Level (94%)

Opis :

1. Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 3TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 24x DIMM slots
3. 2 PCI-E 3.0 x16, 3 PCI-E 3.0 x8.
    1 PCI-E 2.0 x4 (in x8)
    Slot 3 & 1 occupied by controller
    and JBOD expansion port
4. Quad 10GBase-T LAN w/ Intel® X540
5. 36x 3.5" Hot-swap SAS3/SATA3 drive
    bays (24 front + 12 rear); 4x 2.5"
    internal fixed drive bays
6. SAS3 via Broadcom 3108 AOC (HW RAID)
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 7x 80mm middle cooling fans
9. 1280W Redundant Power Supplies
    Platinum Level (94%)

Opis :

1. Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family (up to 160W TDP)
2. Up to 3TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 24 DIMM slots
3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8
4. SIOM for flexible networking options
5. 45 Hot-swap 3.5" SAS3/SATA3 drive
    bays; 2 rear Hot-swap 2.5" SATA
    drive bays; optional 6 NVMe bays
6. Broadcom 3108 SAS3, HW RAID
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 5 hot-swap 8cm redundant PWM fans
    PWM fans
9. 1600W Redundant Power Supplies
    Platinum Level (94%+) Certified
10. Front 3.5" LCD display

Opis :

1. Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family (up to 160W TDP)
2. Up to 3TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 24 DIMM slots
3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8
4. SIOM for flexible networking options
5. 45 Hot-swap 3.5" SAS3/SATA3 drive
    bays; 2 rear Hot-swap 2.5" SATA
    drive bays; optional 6 NVMe bays
6. Broadcom 3008 SAS3 IT mode controller
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 5 hot-swap 8cm redundant PWM fans
    PWM fans
9. 1600W Redundant Power Supplies
    Platinum Level (94%+) Certified
10. Front 3.5" LCD display

Opis :

1. Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family (up to 160W TDP)
2. Up to 3TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 24x DIMM slots
3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8
4. SIOM for flexible networking options
5. 60x 3.5" Hot-swap SAS3/SATA3 drive
    bays; 2x 2.5" rear Hot-swap SATA
    drive bays; optional 6x NVMe bays
6. Broadcom 3008 SAS3 IT mode controller
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 5x 8cm hot-swap redundant PWM fans
    PWM fans
9. 2000W Redundant Power Supplies
    Titanium Level (96%) Certified
10. Front 3.5" LCD display

Opis :

1. Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family (up to 160W TDP)
2. Up to 3TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 24x DIMM slots
3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8
4. SIOM for flexible networking options
5. 60x 3.5" Hot-swap SAS3/SATA3 drive
    bays; 2x 2.5" rear Hot-swap SATA
    drive bays; optional 6 NVMe bays
6. Broadcom 3108 SAS3 HW RAID controller
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 5x 8cm hot-swap redundant PWM fans
    PWM fans
9. 2000W Redundant Power Supplies
    Titanium Level (96%) Certified
10. Front 3.5" LCD display

Opis :

1. Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 2TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 16x DIMM slots
3. 1x PCI-E 3.0 x16, 6x PCI-E 3.0 x8
    (3 slots occupied by IT Mode
    disk controllers, Broadcom 3008)
4. Dual 10GBase-T LAN w/ Intel® X540
5. 72x 3.5" Hot-swap SAS3/SATA3 drive
    bays; 2x 2.5" Hot-swap SATA drive
    bays (rear)
6. SAS3 via 3x Broadcom 3008 controller;
    IT mode
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 7x 80mm middle cooling fans
9. 2000W High efficiency (96%)
    Redundant PSU; Titanium Level

Opis :

1. Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 1TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 8x DIMM slots
3. SIOM card for multiple IO options
4. 90x 3.5" Hot-swap SAS3/SATA3 drive
    bays; 2x 2.5" rear Hot-swap SATA
    drive bays
5. 2 Onboard Broadcom 3008 SAS3 controllers
6. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
7. 5x 8cm hot-swap redundant PWM fans
8. 4x 1000W Redundant Power Supplies
    Titanium Level (96%) Certified

Opis :

1. Single socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 1TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 8x DIMM slots
3. 1 PCI-E 3.0 x4 (in x8), 1 PCI-E 3.0 x8
    (in x16), 2 PCI-E 3.0 x8, 1 PCI-E 2.0
    x2 (in x4), 1 PCI-E 2.0 x4 (in x8)
4. Intel® i350-AM4 Quad port GbE LAN
5. 36x 3.5" Hot-swap SAS3 HDD Bays
    (24 front + 12 rear);
    Opt. 2x 2.5" Hot-swap HDD bays (rear)
6. SAS3 via Broadcom 3008 controller; IR mode
7. Dual JBOD expansion ports
8. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
9. 7x 80mm middle cooling fans
10. 1280W Redundant Power Supplies
    Platinum Level (94%)

Opis :

Two hot-pluggable
1. Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 1TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 8x DIMM slots
3. 3 PCI-E 3.0 x8 (1 FHHL, 2 LPHL)
    expansion slots per controller;
    up to 3 add-on cards
4. Dual 10GBase-T LAN w/ Intel® X540;
    100Mb private Ethernet between
    controller nodes
5. 16x 3.5" Hot-swap SAS3/SATA3 drive
    bays with SES2
6. SAS3 via Broadcom 3008 controller
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 12x 4cm PWM cooling fans
9. 1200W Redundant Power Supplies
    Titanium Level (96%)

Opis :

Two hot-pluggable
1. Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 1TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 8x DIMM slots
3. 3 PCI-E 3.0 x8 (1 FHHL, 2 LPHL)
    expansion slots per controller
4. Dual 10GBase-T LAN w/ Intel® X540;
    100Mb private Ethernet between
    controller nodes
5. 24x 3.5" Hot-swap SAS drive bays
    with SES2
6. SAS3 via Broadcom 3008 controller
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
8. 4x 8cm and 4x 4cm PWM cooling fans
9. 1600W Redundant Power Supplies
    Titanium Level (96%)

Opis :

Two hot-pluggable
1. High Availability Storage
    Appliance Platform
2. Redundant Hot-swap expander
    trays
3. 4 SAS3.0 IO ports
4. 24 Hot-swap 2.5" Drive Bays
5. IPMI 2.0 with dedicated LAN
6. 8x 40mm cooling fans
7. 1200W Redundant Power Supplies
    Titanium Level Certified

Opis :

Two hot-pluggable
1. High Availability Storage
    Appliance Platform
2. Redundant Hot-swap expander
    trays
3. 4 SAS3.0 IO ports
4. 16 Hot-swap 3.5" Drive Bays
5. IPMI 2.0 with dedicated LAN
6. 12x 40mm cooling fans
7. 1200W Redundant Power Supplies
    Titanium Level Certified