SuperServer 2029U-E1CR4 (Complete System Only)- Supermicro
Znajdź w sklepie Bizserver
Opis:
Virtualization Hyperconverge Storage Cloud Computing High End Enterprise Server
1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡
2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††
3. 1 PCI-E 3.0 x16 slot (FH, 10.5" L), 5 PCI-E 3.0 x8 slots (FH, 10.5" L), 1 PCI-E 3.0 x8 slot (LP), 1 PCI-E 3.0 x8 slot (internal LP)
4. 4 1GbE LAN ports via Intel i350
5. 24 Hot-swap 2.5" drive bays: 24 SAS3 via opt. AOC (4 hybrid ports - opt. 4 NVMe), Optional 2 hot-swap 2.5" rear drive bays for SSDs; Optional M.2 NVMe and SATA3 ports
6. VGA: Aspeed AST2500
7. 4 Heavy duty 8cm PWM fans
8. 1000W Redundant Power Supplies Titanium Level (96%)
Virtualization Hyperconverge Storage Cloud Computing High End Enterprise Server
1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡
2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††
3. 1 PCI-E 3.0 x16 slot (FH, 10.5" L), 5 PCI-E 3.0 x8 slots (FH, 10.5" L), 1 PCI-E 3.0 x8 slot (LP), 1 PCI-E 3.0 x8 slot (internal LP)
4. 4 1GbE LAN ports via Intel i350
5. 24 Hot-swap 2.5" drive bays: 24 SAS3 via opt. AOC (4 hybrid ports - opt. 4 NVMe), Optional 2 hot-swap 2.5" rear drive bays for SSDs; Optional M.2 NVMe and SATA3 ports
6. VGA: Aspeed AST2500
7. 4 Heavy duty 8cm PWM fans
8. 1000W Redundant Power Supplies Titanium Level (96%)
Specyfikacja
Ogólne
Producent:
Supermicro
Nazwa:
SuperServer 2029U-E1CR4 (Black)
Płyta główna:
Super X11DPU
Procesor
Procesor:
Dual Socket P (LGA 3647)
2nd Gen. Intel® Xeon® Scalable Processors (Cascade Lake/Skylake)‡Dual UPI up to 10.4GT/s
Support CPU TDP 70-205W
2nd Gen. Intel® Xeon® Scalable Processors (Cascade Lake/Skylake)‡Dual UPI up to 10.4GT/s
Support CPU TDP 70-205W
Rdzenie:
Up to 28 Cores
Pamięć
Pojemność pamięci:
24 DIMM slots
Up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM
Supports Intel® Optane™ DCPMM††
Up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM
Supports Intel® Optane™ DCPMM††
Typ pamięci:
2933†/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
2666 ECC DDR4 NVDIMM
2666 ECC DDR4 NVDIMM
Specyfikacja płyty
Chipset:
Intel® C621 chipset
SAS:
SAS3 (12Gbps) via expander + Broadcom 3108/3008 AOC
Łączność sieciowa:
4x 1GbE LAN ports via Intel® i350 (AOC-2UR68-i4G)
IPMI:
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
USB:
3 USB 3.0 ports(2 rear 1 Type A)
Grafika:
ASPEED AST2500 BMC
LAN:
4 RJ45 1GbE LAN ports
1 RJ45 Dedicated IPMI LAN port
1 RJ45 Dedicated IPMI LAN port
Video:
1 VGA Connector
Port szeregowy:
1 Serial header
PCI-Express:
1 PCI-E 3.0 x16 (FH 10.5" L)
5 PCI-E 3.0 x8 (FH 10.5" L)
1 PCI-E 3.0 x8 (LP)
1 PCI-E 3.0 x8 (internal LP) (Both CPUs need to be installed for full access to PCI-E slots and onboard controllers. See manual block diagram and AOC Support for details.)
5 PCI-E 3.0 x8 (FH 10.5" L)
1 PCI-E 3.0 x8 (LP)
1 PCI-E 3.0 x8 (internal LP) (Both CPUs need to be installed for full access to PCI-E slots and onboard controllers. See manual block diagram and AOC Support for details.)
M.2:
1 M.2 PCI-E 3.0 x4 M-Key NVMe and 1 M.2 M-Key SATA3 via optional parts (2240/2260/2280/22110)
2 M.2 PCI-E 3.0 x4 M-Key NVMe via optional add-on card AOC-SLG3-2M2 (2260/2280/22110)
2 M.2 PCI-E 3.0 x4 M-Key NVMe via optional add-on card AOC-SLG3-2M2 (2260/2280/22110)
Hot-swap:
1 M.2 PCI-E 3.0 x4 M-Key NVMe and 1 M.2 M-Key SATA3 via optional parts (2240/2260/2280/22110)
2 M.2 PCI-E 3.0 x4 M-Key NVMe via optional add-on card AOC-SLG3-2M2 (2260/2280/22110)
2 M.2 PCI-E 3.0 x4 M-Key NVMe via optional add-on card AOC-SLG3-2M2 (2260/2280/22110)
Specyfikacja BIOSu
Typ BIOSu:
AMI 32Mb SPI Flash ROM
Oprogramowanie
Oprogramowanie:
Intel® Node Manager
Redfish API
IPMI 2.0
KVM with dedicated LAN
NMI
SSM SPM SUM
SuperDoctor® 5
Redfish API
IPMI 2.0
KVM with dedicated LAN
NMI
SSM SPM SUM
SuperDoctor® 5
Obudowa serwerowa
Rodzaj obudowy:
2U Rackmount
Model obudowy:
CSE-219U2E1C4-R1K02-T
Wymiary
Wysokość:
3.5" (89mm)
Szerokość:
17.2" (437mm)
Długość:
27.76" (705.3mm)
Waga:
Net Weight: 36 lbs (16.4 kg)
Gross Weight: 72 lbs (32.7 kg)
Gross Weight: 72 lbs (32.7 kg)
Panel Przedni
Panel przedni - przyciski:
Power On/Off button
System Reset button
System Reset button
Panel przedni - LEDy:
Power status LED
HDD activity LED
Network activity LEDs
System information (overheat/UID) LED
HDD activity LED
Network activity LEDs
System information (overheat/UID) LED
Chłodzenie
Wentylatory:
4 heavy duty 8cm PWM fans
Zasilanie
Konfiguracja mocy:
ACPI Power Management
Zasilacz:
1000W Redundant Power Supplies with PMBus
Wejście AC:
100-127Vac / 9.8 - 7A / 50-60Hz
200-240Vac / 7 - 5A / 50-60Hz
200-240Vdc / 7 - 5A (for CCC only)
200-240Vac / 7 - 5A / 50-60Hz
200-240Vdc / 7 - 5A (for CCC only)
+12V:
Max: 66.7A / Min: 0A (100-127Vac)
Max: 83A / Min: 0A (200-240Vac)
Max: 83A / Min: 0A (200-240Vdc)
Max: 83A / Min: 0A (200-240Vac)
Max: 83A / Min: 0A (200-240Vdc)
12V SB:
Max: 2.1A / Min: 0A
Środowisko Operacyjne
RoHS:
RoHS Compliant
Specyfikacja środowiskowa:
Operating Temperature:
10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
Lista podzespołów
| Parts List - (Items Included) | |||
| |
Part Number |
Ile |
Opis |
| Płyta główna / Obudowa | MBD-X11DPU CSE-219U2E1C4-R1K02-T |
1 1 |
Super X11DPU Płyta główna 2U Obudowa |
| Add-on Card / Module | AOC-2UR68-I4G-P | 1 | 2U Ultra Riser based on Intel i350AM4 controller with 4 GbE RJ45 ports, 1 internal PCI-E x8 3.0 slot, 1 PCI-E x16 3.0, and I PCI-E x8 3.0 (in x16 slot) |
| Backplane | BPN-SAS3-216EL1-N4 | 1 | 24-port 2U SAS3 12Gbps single-expander backplane, support up to 20x 2.5-inch SAS3/SATA3 HDD/SSD and 4x NVMe/SAS3/SATA3 storage devices |
| Cable 1 | CBL-PWEX-0673 | 3 | 8 pin female to 2x big 4 pin female power, 65/70CM, 18AWG,RoHS/REACH |
| Cable 2 | CBL-SAST-0593 | 2 | MINI SAS HD,12G,INT,60CM,30AWG |
| Air Shroud | MCP-310-82921-0N | 1 | Plastic air shroud for SC829U, 219U (X11 24DIMM, left side) |
| Air Shroud | MCP-310-82922-0N | 1 | Plastic air shroud for SC829U, 219U (X11 24DIMM, right side) |
| Riser Card | RSC-R1UW-E8R | 1 | 1U RHS WIO Riser card with one PCI-E x8 slot |
| Riser Card | RSC-R2UW-4E8 | 1 | 2U LHS WIO Riser card with four PCI-E x4 slots |
| Heatsink / Retention | SNK-P0068PS | 2 | 2U Passive CPU Heat Sink for X11 Purley Platform Equipped with a Narrow Retention Mechanism |
| Zasilacz | PWS-1K02A-1R | 2 | 1U 1000W Redundant Zasilacz 73.5mm width Titanium Level,RoHS/REACH |
| FAN 1 | FAN-0118L4 | 4 | 80 x 80 x 38 mm, 9.5K RPM, 4-pin PWM Fan, Hot |