Dual-Socket Blade SBI-6129P-T3N- Supermicro
Znajdź w sklepie Bizserver
Opis:
1. 140 CPUs per 42U Rack
2. Dual socket P (LGA 3647) supports 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡
3. Intel® C622 chipset
4. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††
5. 3 Hot-plug 2.5" NVMe or 3 Hot-plug SATA3 drive bays
6. Intel® C622; RAID 0, 1, 5
7. Dual 10G onboard
8. IPMI 2.0, KVM over IP, Virtual Media over LAN
9. Graphics: Aspeed AST2500 BMC
1. 140 CPUs per 42U Rack
2. Dual socket P (LGA 3647) supports 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡
3. Intel® C622 chipset
4. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††
5. 3 Hot-plug 2.5" NVMe or 3 Hot-plug SATA3 drive bays
6. Intel® C622; RAID 0, 1, 5
7. Dual 10G onboard
8. IPMI 2.0, KVM over IP, Virtual Media over LAN
9. Graphics: Aspeed AST2500 BMC
Specyfikacja
Ogólne
Producent:
Supermicro
Nazwa:
Dual-Socket Blade SBI-6129P-T3N
Płyta główna:
Super B11DPE
Procesor
Procesor:
Dual Socket P (LGA 3647)
2nd Gen. Intel® Xeon® Scalable Processors (Cascade Lake/Skylake)‡3 UPI up to 10.4GT/s
Support CPU TDP 70-205W
2nd Gen. Intel® Xeon® Scalable Processors (Cascade Lake/Skylake)‡3 UPI up to 10.4GT/s
Support CPU TDP 70-205W
Rdzenie:
Up to 28 Cores
Pamięć
Pojemność pamięci:
24 DIMM slots
Up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM
Supports Intel® Optane™ DCPMM††
Up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM
Supports Intel® Optane™ DCPMM††
Typ pamięci:
2933†/2666/2400MHz ECC DDR4 RDIMM/LRDIMM
Specyfikacja płyty
Chipset:
Intel® C622 chipset
IPMI:
Support for Intelligent Platform Management Interface (IPMI) v.2.0 via Chassis Management Module (CMM)
Grafika:
Aspeed AST2500 BMC
Specyfikacja BIOSu
Typ BIOSu:
128Mb SPI Flash EEPROM with AMI® BIOS
Cechy BIOSu:
Plug and Play (PnP)
PCI 2.2
ACPI up to 3.0
USB Keyboard support
PCI 2.2
ACPI up to 3.0
USB Keyboard support
Wymiary
Wysokość:
9.75"
Szerokość:
1.75"
Długość:
23.5"
Waga:
12.6 lbs (5.71 kg)
Panel Przedni
Panel przedni - przyciski:
Power On/Off button
KVM button
KVM button
Panel przedni - LEDy:
Power LED
UID / KVM LED
Network Activity LED
Fault LED
UID / KVM LED
Network Activity LED
Fault LED
Środowisko Operacyjne
RoHS:
RoHS Compliant
Specyfikacja środowiskowa:
Operating Temperature:
10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
Lista podzespołów
| Parts List - (Items Included) | |||
| Part Number | Ile | Opis | |
| Płyta główna / Obudowa | MBD-B11DPE MCP-680-61003-0N |
1 1 |
Super B11DPE Płyta główna 6U 10 SuperBlade DP Blade chassis |
| Add-on Card / Module | AOM-BPNIO-SNE-P | 1 | AOM-BPNIO-SC, I/O module for uBlade,RoHS |
| Add-on Card / Module | AOM-BPNIO-SNE-P | 1 | I/O module for 6U Super Blade,RoHS , support up to 3 NVMe or SATA |
| Hard Drive Tray | MCP-220-00145-0B | 3 | Black 2.5" NVMe Hard Drive Tray, orange button |
| Air Shroud | MCP-310-61001-0B | 4 | 6U 10 SuperBlade B11DPE Processor Tray Air Shroud |