SuperServer F629P3-RC0B- Supermicro
Znajdź w sklepie Bizserver
Opis:
1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡
2. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††
3. Expansion slots: 1 PCI-E 3.0 x16 (LP) 1 PCI-E 3.0 x16 (for SIOM )
4. SIOM Network card, 1 dedicated IPMI LAN port
5. 1 VGA, 2 USB 3.0 ports
6. 8 Hot-swap 3.5" SAS3/SATA3 or 6 Hot-swap 3.5" SAS3/SATA3 + 2 optional NVMe U.2 M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2260, 2280, 22110 M.2 Key: M-Key
7. SAS3 via Broadcom 3008
8. 2x 8cm 14k RPM middle fans
9. 1200W Redundant Power Supplies Titanium Level (96% Efficiency)
1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡
2. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††
3. Expansion slots: 1 PCI-E 3.0 x16 (LP) 1 PCI-E 3.0 x16 (for SIOM )
4. SIOM Network card, 1 dedicated IPMI LAN port
5. 1 VGA, 2 USB 3.0 ports
6. 8 Hot-swap 3.5" SAS3/SATA3 or 6 Hot-swap 3.5" SAS3/SATA3 + 2 optional NVMe U.2 M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2260, 2280, 22110 M.2 Key: M-Key
7. SAS3 via Broadcom 3008
8. 2x 8cm 14k RPM middle fans
9. 1200W Redundant Power Supplies Titanium Level (96% Efficiency)
Specyfikacja
Ogólne
Producent:
Supermicro
Nazwa:
SuperServer F629P3-RC0B (Black)
Płyta główna:
Super X11DPFR-SN
Procesor
Procesor:
Dual Socket P (LGA 3647)
2nd Gen. Intel® Xeon® Scalable Processors (Cascade Lake/Skylake)‡Dual UPI up to 10.4GT/s
Support CPU TDP 70-165W with IVR
2nd Gen. Intel® Xeon® Scalable Processors (Cascade Lake/Skylake)‡Dual UPI up to 10.4GT/s
Support CPU TDP 70-165W with IVR
Rdzenie:
Up to 28 Cores
Pamięć
Pojemność pamięci:
12 DIMM slots
Up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM
Supports Intel® Optane™ DCPMM††
Up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM
Supports Intel® Optane™ DCPMM††
Typ pamięci:
2933†/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
Specyfikacja płyty
Chipset:
Intel® C621 chipset
SAS:
SAS3 (12Gbps) via Broadcom 3008
IPMI:
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
USB:
2 USB 3.0 ports (rear)
Grafika:
ASPEED AST2500 BMC
LAN:
SIOM flexible Network card
1 RJ45 Dedicated IPMI LAN port
1 RJ45 Dedicated IPMI LAN port
PCI-Express:
1 PCI-E 3.0 x16 (Low-profile)
1 PCI-E 3.0 x16 (SIOM)
1 PCI-E 3.0 x16 (SIOM)
M.2:
M.2 Interface: PCI-E 3.0 x4
M.2 Form Factor: 2260 2280 22110
M.2 Key: M-Key
M.2 Form Factor: 2260 2280 22110
M.2 Key: M-Key
Hot-swap:
M.2 Interface: PCI-E 3.0 x4
M.2 Form Factor: 2260 2280 22110
M.2 Key: M-Key
M.2 Form Factor: 2260 2280 22110
M.2 Key: M-Key
Specyfikacja BIOSu
Typ BIOSu:
128Mb SPI Flash EEPROM with AMI BIOS
Oprogramowanie
Oprogramowanie:
Intel® Node Manager
IPMI 2.0
KVM with dedicated LAN
SuperDoctor® 5
Watch Dog
IPMI 2.0
KVM with dedicated LAN
SuperDoctor® 5
Watch Dog
Obudowa serwerowa
Rodzaj obudowy:
4U Rackmount
Model obudowy:
CSE-F424AS2-R1K23BP
Wymiary
Wysokość:
6.96" (177mm)
Szerokość:
17.63" (448mm)
Długość:
29" (737mm)
Waga:
Net Weight: 150 lbs (68.04 kg)
Gross Weight: 200 lbs (90.71 kg)
Gross Weight: 200 lbs (90.71 kg)
Panel Przedni
Panel przedni - przyciski:
Power On/Off button
UID button
UID button
Panel przedni - LEDy:
Power status LED
Hard drive activity LED
Network activity LEDs
Information LED (UID Fan failure Overheat)
Hard drive activity LED
Network activity LEDs
Information LED (UID Fan failure Overheat)
Chłodzenie
Wentylatory:
2x 8cm 14 RPM middle fans
Zasilanie
Konfiguracja mocy:
ACPI Power Management
Wejście AC:
100-127Vac / 15-12A / 50-60Hz
200-240Vac / 8.5-7A / 50-60Hz
200-240Vdc / 8.5-7A (for CCC only)
200-240Vac / 8.5-7A / 50-60Hz
200-240Vdc / 8.5-7A (for CCC only)
+12V:
Max: 83A / Min: 0A (100-127Vac)
Max: 100A / Min: 0A (200-240Vac)
Max: 100A / Min: 0A (200-240Vdc)
Max: 100A / Min: 0A (200-240Vac)
Max: 100A / Min: 0A (200-240Vdc)
Środowisko Operacyjne
RoHS:
RoHS Compliant
Specyfikacja środowiskowa:
Operating Temperature:
10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
Lista podzespołów
| Parts List - (Items Included) | |||
| |
Part Number |
Ile |
Opis |
| Płyta główna / Obudowa | MBD-X11DPFR-SN CSE-F424AS2-R1K23BP |
4 1 |
Super X11DPFR-SN Płyta główna 4U Obudowa |
| Backplane | BPN-ADP-8S3008-1UF | 4 | BPN-ADP-8S3008-1UF |
| Backplane | BPN-ADP-X11DPFR | 4 | Power distribution board for X11DPFR-S(N) |
| Backplane | BPN-SAS3-F424-A2N2A | 4 | 2-Port Hybrid Backplane support 2 x SAS3/SATA3/NVMe Storage Devices |
| Backplane | BPN-SAS3-F424-A6 | 4 | 6-port Fat Twin SAS3 12Gbps backplane, support up to 6x 3.5-inch SAS3/SATA3 HDD/SSD |
| Cable 1 | CBL-0486L | 12 | 2x2 to 2x2 15cm power cable HF. 18AWG |
| Cable 2 | CBL-OTHR-0022L | 4 | 20 to 20 pin cable for BPN-ADP-F418LS,7.5cm, 28AWG,RoHS/REACH,PBF |
| Cable 3 | CBL-PWCD-0900 | 4 | PWCD,US/EU/Canada/China/Australia,IEC60320 C14 TO C13,4FT,17AWG |
| Cable 4 | CBL-SAST-0691 | 4 | MINI SAS HD RA- 2x MINI SAS HD,INT,15/59CM,28AWG |
| Cable 5 | CBL-SAST-0706 | 4 | MINI SAS HD (reversed RA)-MINI SAS HD,12G,INT,11CM,30AWG |
| Heatsink / Retention | SNK-P0068PSC | 4 | 2U Passive CPU Heat Sink with a Side Air Channel for X11 Purley Platform Equipped with a Narrow Retention Mechanism |
| Heatsink / Retention | SNK-P0069PSC | 4 | 1.5U Proprietary 50-mm Tall Passive CPU Heat Sink with a Side Air Channel for X11 Purley Platform 2U Node Twin Series Servers |
| Zasilacz | PWS-1K23A-1R | 4 | AC-DC 1200W, Titanium Level, Redundancy, 1U, PMBUS 1.2, +12V/+5Vsb, 360x76x40 mm,HF,RoHS/REACH |