SuperServer 6028TP-HC1FR - Supermicro

Global SKU - SuperServer 6028TP-HC1FR - Supermicro
Zdjecie - SuperServer 6028TP-HC1FR - Supermicro
Znajdź w sklepie Bizserver Opis:
Four hot-pluggable
1. Dual socket R (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 2TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 16x DIMM slots
3. 1x PCI-E 3.0 x16 Low-profile slot
4. Single port IB (FDR, 56Gbps),
    w/ QSFP connector
5. Intel® i350-AM2 Dual port GbE LAN
6. Integrated IPMI 2.0 with KVM and
    Dedicated LAN
7. 3x 3.5" Hot-swap SAS/SATA HDD
    Bays
8. Broadcom 3108 SAS3 controller (3 ports);
    RAID 0, 1, 5, 10
9. 2000W Redundant Power Supplies

Specyfikacja

Ogólne

Producent:
Supermicro
Nazwa:
SuperServer 6028TP-HC1FR (Black)
Płyta główna:
Super X10DRT-PIBF

Procesor

Procesor:
Intel® Xeon® processor E5-2600 v4†/ v3 family (up to 145W TDP) *
Dual Socket R3 (LGA 2011)
Rdzenie:
Up to 22 Cores† / Up to 55MB† Cache

Pamięć

Pojemność pamięci:
16x 288-pin DDR4 DIMM slots
Up to 2TB† ECC 3DS LRDIMM 512GB ECC RDIMM
Typ pamięci:
2400†/2133/1866/1600MHz ECC DDR4 SDRAM 72-bit

Specyfikacja płyty

Chipset:
Intel® C612 chipset
IPMI:
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
ASPEED AST2400 BMC
USB:
2x USB 3.0 ports total (2x rear)
Grafika:
ASPEED AST2400 BMC
LAN:
2x RJ45 Gigabit Ethernet LAN ports
1x RJ45 Dedicated IPMI LAN port
Port szeregowy:
1x Fast UART 16550 port / 1 Header (internal)
PCI-Express:
1x PCI-E 3.0 x16 Low-profile slot

Specyfikacja BIOSu

Typ BIOSu:
128Mb SPI Flash EEPROM with AMI BIOS

Obudowa serwerowa

Rodzaj obudowy:
2U Rackmount
Model obudowy:
CSE-827HQ+-R2K04B

Wymiary

Wysokość:
3.47" (88mm)
Szerokość:
17.25" (438mm)
Długość:
30.5" (774mm)
Waga:
Gross Weight: 90 lbs (40.9kg)
Net Weight: 72 lbs (32.7 kg)

Panel Przedni

Panel przedni - przyciski:
Power On/Off button
UID button
Panel przedni - LEDy:
Power status LED
HDD activity LED
2x Network activity LEDs
Universal Information (UID) LED

Chłodzenie

Wentylatory:
4x 8cm heavy duty PWM fans with optimal fan speed control

Zasilanie

Wejście AC:
1000W: 100-127 Vac / 12-9.5 A / 50-60 Hz
1800W: 200-220 Vac / 10-9.5 A / 50-60 Hz
1980W: 220-230 Vac / 10-9.8 A / 50-60 Hz
2000W: 230-240 Vac / 10-9.8 A / 50-60 Hz
2000W: 200-240 Vac / 11.8-9.8 A / 50-60 Hz (UL/cUL only)
+12V:
Max: 83.3A / Min: 0A (100-127 Vac)
Max: 150A / Min: 0A (200-220 Vac)
Max: 165A / Min: 0A (220-230 Vac)
Max: 166.7A / Min: 0A (230-240 Vac)
Max: 166.7A / Min: 0A (200-240 Vac)(UL/cUL only)

Środowisko Operacyjne

RoHS:
Environmental Spec.
Specyfikacja środowiskowa:
Operating Temperature:    10°C to 35°C (50°F to 95°F)
Non-operating Temperature:    -40°C to 70°C (-40°F to 158°F)
Operating Relative Humidity:    8% to 90% (non-condensing)
Non-operating Relative Humidity:    5% to 95% (non-condensing)

Lista podzespołów

Parts List - (Items Included)
 

Part Number

Ile

Opis

Płyta główna / Obudowa MBD-X10DRT-PIBF

CSE-827HQ+-R2K04B
4

1
Super X10DRT-PIBF Płyta główna

2U Obudowa
Backplane BPN-ADP-S3108L-H6IRP 4 LSI 3108, SAS 12Gbps (x6 internal)
Backplane BPN-SAS3-827HQ 1 12-port 2U TwinPro^2 SAS3 CSE-827HQ (3 drives per node) backplane, support up to 12x 3.5-inch SAS3/SATA3 HDD
Cable 1 CBL-PWCD-0578 2 PWCD,US,IEC60320 C14 TO C13,3FT,14AWG
Label LBL-0108 1 CAUTION LABEL FOR REDUNDANT PWR SYSTEMS
Manual MNL-1664-QRG 1 6028TP-HC1R/HC1TR/HC1FR, QRG
Riser Card RSC-R1UTP-E16R 4 1U RHS TwinPro Riser card with one PCI-E x16 slot
Heatsink / Retention SNK-P0057PS 4 1U High Performance Passive CPU Heat Sink for X9, X10 Systems Equipped w/ a Narrow ILM MB
Heatsink / Retention SNK-P0047PSM 4 1U Passive Front CPU Heat Sink w/ a Middle Air Channel for X9, X10 2U Twin^2+ and Twin Pro^2 Series Servers
Air Shroud MCP-310-21703-0B

or

MCP-310-21702-0B
4 TwinPro 217HQ+/827HQ+ X10 plastic air shroud

or

TwinPro 217HQ+/827HQ+ X10 mylay air shroud
Zasilacz PWS-2K04A-1R

or

PWS-2K02P-1R
2 2000W Redundant Titanium Level Power Supplies

or

2000W Redundant Platinum Level Power Supplies