SuperServer F628G3-FC0+ - Supermicro
Znajdź w sklepie Bizserver
Opis:
1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots
3. 3x PCI-E 3.0 x16 slots (support 3x Double-width GPU/Xeon Phi cards), 2x PCI-E 3.0 x8 slots
4. Front I/O ports: 2 GbE LAN, 2 USB 3.0 and 1 VGA connector
5. Built-in Server management tool (IPMI 2.0, KVM/media over LAN) w/ dedicated LAN port
6. 2x 3.5" Hot-swap SAS3/SATA3; SAS3 (12 Gbps) via Broadcom 3008
7. 2000W High efficiency (96%) Redundant PSU; Titanium Level
1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots
3. 3x PCI-E 3.0 x16 slots (support 3x Double-width GPU/Xeon Phi cards), 2x PCI-E 3.0 x8 slots
4. Front I/O ports: 2 GbE LAN, 2 USB 3.0 and 1 VGA connector
5. Built-in Server management tool (IPMI 2.0, KVM/media over LAN) w/ dedicated LAN port
6. 2x 3.5" Hot-swap SAS3/SATA3; SAS3 (12 Gbps) via Broadcom 3008
7. 2000W High efficiency (96%) Redundant PSU; Titanium Level
Specyfikacja
Ogólne
Producent:
Supermicro
Nazwa:
SuperServer F628G3-FC0+ (Black)
Płyta główna:
Super X10DRFF-CG
Procesor
Procesor:
Intel® Xeon® processor E5-2600
v4†/
v3 family
(up to 145W TDP)
*
Dual Socket R3 (LGA 2011)
Dual Socket R3 (LGA 2011)
Rdzenie:
Up to 22 Cores† / Up to 55MB† Cache
Pamięć
Pojemność pamięci:
16x 288-pin DDR4 DIMM slots
Up to 2TB† ECC 3DS LRDIMM 1TB ECC RDIMM
Up to 2TB† ECC 3DS LRDIMM 1TB ECC RDIMM
Typ pamięci:
2400†/2133/1866/1600MHz ECC DDR4 SDRAM 72-bit
Specyfikacja płyty
Chipset:
Intel® C612 chipset
SATA:
SATA3 (6Gbps) with RAID 0 1
IPMI:
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
ASPEED AST2400 BMC
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
ASPEED AST2400 BMC
USB:
2x USB 3.0 ports
Grafika:
ASPEED AST2400 BMC
LAN:
2x RJ45 Gigabit Ethernet LAN ports
1x RJ45 Dedicated IPMI LAN port
1x RJ45 Dedicated IPMI LAN port
PCI-Express:
3x PCI-E 3.0 x16 (FHFL) slots(support 3x Double-width GPU/Xeon Phi)
2x PCI-E 3.0 x8 (LP) slots
2x PCI-E 3.0 x8 (LP) slots
Specyfikacja BIOSu
Typ BIOSu:
128Mb SPI Flash EEPROM with AMI BIOS
Obudowa serwerowa
Rodzaj obudowy:
4U Rackmount
Model obudowy:
CSE-F424AG-R2K04BP
Wymiary
Wysokość:
6.96" (177mm)
Szerokość:
17.63" (448mm)
Długość:
35" (889mm)
Waga:
Net Weight: 105 lbs (47.63 kg)
Gross Weight: 150 lbs (68.04 kg)
Gross Weight: 150 lbs (68.04 kg)
Panel Przedni
Panel przedni - przyciski:
Power On/Off button
UID button
UID button
Panel przedni - LEDy:
Power status LED
UID LED
UID LED
Chłodzenie
Wentylatory:
8x 8cm heavy duty 11K fans with air shroud and PWM fan speed control
Zasilanie
Wejście AC:
1000W: 100-127 Vac / 12-9.5 A / 50-60 Hz
1800W: 200-220 Vac / 10-9.5 A / 50-60 Hz
1980W: 220-230 Vac / 10-9.8 A / 50-60 Hz
2000W: 230-240 Vac / 10-9.8 A / 50-60 Hz
2000W: 200-240 Vac / 11.8-9.8 A / 50-60 Hz (UL/cUL only)
1800W: 200-220 Vac / 10-9.5 A / 50-60 Hz
1980W: 220-230 Vac / 10-9.8 A / 50-60 Hz
2000W: 230-240 Vac / 10-9.8 A / 50-60 Hz
2000W: 200-240 Vac / 11.8-9.8 A / 50-60 Hz (UL/cUL only)
+12V:
Max: 83.3A / Min: 0A (100-127 Vac)
Max: 150A / Min: 0A (200-220 Vac)
Max: 165A / Min: 0A (220-230 Vac)
Max: 166.7A / Min: 0A (230-240 Vac)
Max: 166.7A / Min: 0A (200-240 Vac)(UL/cUL only)
Max: 150A / Min: 0A (200-220 Vac)
Max: 165A / Min: 0A (220-230 Vac)
Max: 166.7A / Min: 0A (230-240 Vac)
Max: 166.7A / Min: 0A (200-240 Vac)(UL/cUL only)
Środowisko Operacyjne
RoHS:
Environmental Spec.
Specyfikacja środowiskowa:
Operating Temperature:
10°C to 35°C (50°F to 95°F)
Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
Lista podzespołów
| Parts List - (Items Included) | |||
| |
Part Number |
Ile |
Opis |
| Płyta główna / Obudowa | MBD-X10DRFF-CG CSE-F424AG-R2K04BP |
4 1 |
Super X10DRFF-CG Płyta główna 4U Obudowa |
| Backplane | BPN-ADP-F418L | 4 | BPN;SASADP;SAS827-H8;H8DTT;cable req |
| Backplane | BPN-ADP-2UGPU | 4 | Backplan adapter card for 2UGPU |
| Backplane | BPN-SAS3-F424-A2 | 4 | 2-port Fat Twin SAS3 12Gbps backplane, support up to 2x 3.5-inch SAS3/SATA3 HDD/SSD |
| Cable 1 | CBL-0460L-02 | 4 | 8 pin Male to two 4 pin Male power cable, 10cm and 7cm. 18AWG |
| Cable 2 | CBL-SAST-0706 | 4 | MINI SAS HD (reversed RA)-MINI SAS HD,12G,INT,11CM,30AWG |
| Cable 3 | CBL-PWEX-0705 | 4 | 8 pin female (10A) to 8 pin female (10A), 12V CPU power cable, 35cm, 16AWG,RoHS/REACH |
| Cable 4 | CBL-PWCD-0578 | 4 | PWCD,US,IEC60320 C14 TO C13,3FT,14AWG |
| Label | LBL-0108 | 1 | CAUTION LABEL FOR REDUNDANT PWR SYSTEMS |
| Manual | MNL-1758-QRG | 1 | Quick Reference Guide for F628G3-FC0+ / FC0PT+ |
| Riser Card | RSC-R2UFF-2E16B | 4 | RSC-R2UFF-2E16B-O-P |
| Riser Card | RSC-F2F-6 | 4 | RSC-F2F-6-O-P |
| Heatsink / Retention | SNK-P0057PS | 4 | 1U High Performance Passive CPU Heat Sink for X9, X10 Systems Equipped w/ a Narrow ILM MB |
| Heatsink / Retention | SNK-P0047PSC | 4 | 1U Passive Front CPU Heat Sink w/ a Side Air Channel for X9, X10 Systems Equipped with a Narrow ILM MB |
| Zasilacz | PWS-2K04A-1R | 4 | AC-DC 2000W, Titanium Level, Redundancy, 1U, PMBus 1.2, +12V/+5Vsb, 360x76x40mm,HF,RoHS/REACH |