SuperServer 2028BT-HNC0R+ (Complete System Only)- Supermicro
Znajdź w sklepie Bizserver
Opis:
- Hyperscale and Hyperconverged Solutions - Compute Intensive Application - HPC, Data Center - Enterprise Server
Four hot-pluggable
1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots
3. 2 PCI-E 3.0 x16 (LP) slots; 1 SIOM card support (flexible networking) Note: must bundle with Network card
4. IPMI 2.0 + KVM with dedicated LAN
5. 6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5" drive bays
6. SAS3 support via Broadcom 3008; IT mode
7. Video via Aspeed AST2400 BMC
8. 4 heavy duty 8cm PWM fans with air shroud
9. 2200W Redundant Power Supplies Titanium Level
10. 2 M.2 Cards support
- Hyperscale and Hyperconverged Solutions - Compute Intensive Application - HPC, Data Center - Enterprise Server
Four hot-pluggable
1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots
3. 2 PCI-E 3.0 x16 (LP) slots; 1 SIOM card support (flexible networking) Note: must bundle with Network card
4. IPMI 2.0 + KVM with dedicated LAN
5. 6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5" drive bays
6. SAS3 support via Broadcom 3008; IT mode
7. Video via Aspeed AST2400 BMC
8. 4 heavy duty 8cm PWM fans with air shroud
9. 2200W Redundant Power Supplies Titanium Level
10. 2 M.2 Cards support
Specyfikacja
Ogólne
Producent:
Supermicro
Nazwa:
SuperServer 2028BT-HNC0R+ (Black)
Płyta główna:
Super X10DRT-B+
Procesor
Procesor:
Intel® Xeon® processor E5-2600
v4†/
v3 family
(up to 145W TDP)
*
Dual Socket R3 (LGA 2011)
Dual Socket R3 (LGA 2011)
Rdzenie:
Up to 22 Cores† / Up to 55MB† Cache
Pamięć
Pojemność pamięci:
24x 288-pin DDR4 DIMM slots
Up to 3TB† ECC 3DS LRDIMM 768GB ECC RDIMM
Up to 3TB† ECC 3DS LRDIMM 768GB ECC RDIMM
Typ pamięci:
2400†/2133/1866/1600MHz ECC DDR4 SDRAM 72-bit
Specyfikacja płyty
Chipset:
Intel® C612 chipset
IPMI:
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
ASPEED AST2400 BMC
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
ASPEED AST2400 BMC
USB:
2 USB 3.0 ports (rear)
LAN:
1 RJ45 Dedicated IPMI LAN port
Video:
1 VGA port
PCI-Express:
2 PCI-E 3.0 (x16) Low-profile slots
1 SIOM card (must bundle with network card)
1 SIOM card (must bundle with network card)
Specyfikacja BIOSu
Typ BIOSu:
128Mb SPI Flash EEPROM with AMI BIOS
Obudowa serwerowa
Rodzaj obudowy:
2U Rackmount
Model obudowy:
CSE-217BHQ+-R2K22BP
Wymiary
Wysokość:
3.47" (88mm)
Szerokość:
17.6" (447mm)
Długość:
28.75" (730mm)
Waga:
Gross Weight: 85 lbs (38.6kg)
Net Weight: 54.5 lbs (24.7 kg)
Net Weight: 54.5 lbs (24.7 kg)
Panel Przedni
Panel przedni - przyciski:
Power On/Off button
UID button
UID button
Panel przedni - LEDy:
Power status LED
HDD activity LED
2 Network activity LEDs
Universal Information (UID) LED
HDD activity LED
2 Network activity LEDs
Universal Information (UID) LED
Chłodzenie
Wentylatory:
4 heavy duty 8cm PWM fans with air shroud
Zasilanie
Zasilacz:
2200W Redundant Power Supplies with PMBus
Wejście AC:
1200W: 100-127Vac / 50-60Hz
1800W: 200-220Vac / 50-60Hz
1980W: 220-230Vac / 50-60Hz
2090W: 230-240Vac / 50-60Hz
2090W: 180-220Vac (for UL/cUL only)
2200W: 220-240Vac (for UL/cUL only)
2090W: 230-240Vdc (for CCC only)
1800W: 200-220Vac / 50-60Hz
1980W: 220-230Vac / 50-60Hz
2090W: 230-240Vac / 50-60Hz
2090W: 180-220Vac (for UL/cUL only)
2200W: 220-240Vac (for UL/cUL only)
2090W: 230-240Vdc (for CCC only)
+12V:
Max: 100A / Min: 0A (100-127Vac)
Max: 150A / Min: 0A (200-220Vac)
Max: 165A / Min: 0A (220-230Vac)
Max: 174.17A / Min: 0A (230-240Vac)
Max: 174.17A / Min: 0A (180-220Vac UL/cUL only)
Max: 183.33A / Min: 0A (220-240Vac UL/cUL only)
Max: 174.17A / Min: 0A (230-240Vdc CCC only)
Max: 150A / Min: 0A (200-220Vac)
Max: 165A / Min: 0A (220-230Vac)
Max: 174.17A / Min: 0A (230-240Vac)
Max: 174.17A / Min: 0A (180-220Vac UL/cUL only)
Max: 183.33A / Min: 0A (220-240Vac UL/cUL only)
Max: 174.17A / Min: 0A (230-240Vdc CCC only)
12V SB:
Max: 2.1A / Min: 0A
Środowisko Operacyjne
RoHS:
Environmental Spec.
Specyfikacja środowiskowa:
Operating Temperature:
10°C to 35°C (50°F to 95°F)
Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
Lista podzespołów
| Parts List - (Items Included) | |||
| |
Part Number |
Ile |
Opis |
| Płyta główna / Obudowa | MBD-X10DRT-B+ CSE-217BHQ+-R2K22BP |
4 1 |
Super X10DRT-B+ Płyta główna 2U Obudowa |
| Backplane | BPN-ADP-6S3008N4-1UB | 4 | Big Twin 1U hybrid ADP supporting 6x SAS3 and 4x NVMe |
| Backplane | BPN-SAS3-217BHQ-N4 | 1 | 2U 4-Node 24-Port Backplane Supports 2x2.5" SATA3/SAS3 SSD/HDD and 4x2.5" SATA3/SAS3/NVMe Stoage Media per Node |
| Cable 1 | CBL-PWCD-0578 | 2 | PWCD,US,IEC60320 C14 TO C13,3FT,14AWG |
| Drive Tray(s) | MCP-220-00141-0B-BULK | 8 | Black Gen3 hot-swap 2.5 inch HDD tray with lock improved EMI |
| Drive Tray(s) | MCP-220-00144-0B-BULK | 16 | Black Gen3 hot-swap 2.5 inch HDD tray with lock, orange tab |
| Parts | MCP-240-21730-0N | 1 | 217B BigTwin type I (Impact) BPN retention bkt w/ foam assy |
| Air Shroud | MCP-310-21706-0B | 4 | SC217B/827B BigTwin air shroud for X10DRT-B+ |
| Riser Card | RSC-P-6 | 4 | RSC-P-6 (1U LHS TwinPro RSC with 1 PCI-Ex16),RoHS |
| Riser Card | RSC-R1UTP-E16R | 4 | 1U RHS TwinPro Riser card with one PCI-E x16 slot |
| Heatsink / Retention | SNK-P0047PSM | 4 | 1U Passive Front CPU Heat Sink w/ a Middle Air Channel for X9, X10 2U Twin^2+ and Twin Pro^2 Series Servers |
| Heatsink / Retention | SNK-P0057PS | 4 | 1U High Performance Passive CPU Heat Sink for X9, X10 Systems Equipped w/ a Narrow ILM MB |
| Zasilacz | PWS-2K22A-1R | 2 | 1U 2200W Redundant Zasilacz Titanium, 45(W) X 40(H) X 48 |