SuperServer 6028TP-HC0R-SIOM - Supermicro
Znajdź w sklepie Bizserver
Opis:
Four hot-pluggable
1. Dual socket R (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots
3. 1 PCI-E 3.0 x16 (LP), 1 PCI-E 3.0 x8 (LP), 1 SIOM card support
4. 1 Dedicated IPMI LAN port
5. 3 Hot-swap 3.5" SAS/SATA HDD Bays
6. Broadcom 3008 SAS3 controller (8 ports); RAID 0, 1, 10
7. Mini-mSATA (half size) support
8. 2000W Redundant Power Supplies Titanium Level (96%)
9. 1 SATA DOM
Four hot-pluggable
1. Dual socket R (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots
3. 1 PCI-E 3.0 x16 (LP), 1 PCI-E 3.0 x8 (LP), 1 SIOM card support
4. 1 Dedicated IPMI LAN port
5. 3 Hot-swap 3.5" SAS/SATA HDD Bays
6. Broadcom 3008 SAS3 controller (8 ports); RAID 0, 1, 10
7. Mini-mSATA (half size) support
8. 2000W Redundant Power Supplies Titanium Level (96%)
9. 1 SATA DOM
Specyfikacja
Ogólne
Producent:
Supermicro
Nazwa:
SuperServer 6028TP-HC0R-SIOM (Black)
Płyta główna:
Super X10DRT-PS
Procesor
Procesor:
Intel® Xeon® processor E5-2600
v4†/
v3 family
(up to 145W TDP)
*
Dual Socket R3 (LGA 2011)
Dual Socket R3 (LGA 2011)
Rdzenie:
Up to 22 Cores† / Up to 55MB† Cache
Pamięć
Pojemność pamięci:
16x 288-pin DDR4 DIMM slots
Up to 2TB† ECC 3DS LRDIMM 512 ECC RDIMM
Up to 2TB† ECC 3DS LRDIMM 512 ECC RDIMM
Typ pamięci:
2400†/2133/1866/1600MHz ECC DDR4 SDRAM 72-bit
Specyfikacja płyty
Chipset:
Intel® C612 chipset
IPMI:
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
ASPEED AST2400 BMC
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
ASPEED AST2400 BMC
USB:
2 USB 3.0 ports total (rear)
Grafika:
ASPEED AST2400 BMC
LAN:
1 RJ45 Dedicated IPMI LAN port
Port szeregowy:
1 Fast UART 16550 port / 1 Header (internal)
PCI-Express:
1 PCI-E 3.0 (x16) Low-profile slot
1 PCI-E 3.0 (x8) Low-profile slot
1 SIOM card support Note: Must bundle with Network Card
1 PCI-E 3.0 (x8) Low-profile slot
1 SIOM card support Note: Must bundle with Network Card
Specyfikacja BIOSu
Typ BIOSu:
128Mb SPI Flash EEPROM with AMI BIOS
Obudowa serwerowa
Rodzaj obudowy:
2U Rackmount
Model obudowy:
CSE-827HQ+-R2K04B
Wymiary
Wysokość:
3.47" (88mm)
Szerokość:
17.25" (438mm)
Długość:
30.5" (774mm)
Waga:
Gross Weight: 90 lbs (40.9kg)
Net Weight: 72 lbs (32.7 kg)
Net Weight: 72 lbs (32.7 kg)
Panel Przedni
Panel przedni - przyciski:
Power On/Off button
UID button
UID button
Panel przedni - LEDy:
Power status LED
HDD activity LED
Network activity LEDs
Universal Information (UID) LED
HDD activity LED
Network activity LEDs
Universal Information (UID) LED
Chłodzenie
Wentylatory:
4x 8cm heavy duty PWM fans with optimal fan speed control
Zasilanie
Wejście AC:
1000W: 100-127 Vac / 12-9.5 A / 50-60 Hz
1800W: 200-220 Vac / 10-9.5 A / 50-60 Hz
1980W: 220-230 Vac / 10-9.8 A / 50-60 Hz
2000W: 230-240 Vac / 10-9.8 A / 50-60 Hz
2000W: 200-240 Vac / 11.8-9.8 A / 50-60 Hz (UL/cUL only)
1800W: 200-220 Vac / 10-9.5 A / 50-60 Hz
1980W: 220-230 Vac / 10-9.8 A / 50-60 Hz
2000W: 230-240 Vac / 10-9.8 A / 50-60 Hz
2000W: 200-240 Vac / 11.8-9.8 A / 50-60 Hz (UL/cUL only)
+12V:
Max: 83.3A / Min: 0A (100-127 Vac)
Max: 150A / Min: 0A (200-220 Vac)
Max: 165A / Min: 0A (220-230 Vac)
Max: 166.7A / Min: 0A (230-240 Vac)
Max: 166.7A / Min: 0A (200-240 Vac)(UL/cUL only)
Max: 150A / Min: 0A (200-220 Vac)
Max: 165A / Min: 0A (220-230 Vac)
Max: 166.7A / Min: 0A (230-240 Vac)
Max: 166.7A / Min: 0A (200-240 Vac)(UL/cUL only)
Środowisko Operacyjne
RoHS:
Environmental Spec.
Specyfikacja środowiskowa:
Operating Temperature:
10°C to 35°C (50°F to 95°F)
Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
Lista podzespołów
| Parts List - (Items Included) | |||
| |
Part Number |
Ile |
Opis |
| Płyta główna / Obudowa | MBD-X10DRT-PS CSE-827HQ+-R2K04B |
4 1 |
Super X10DRT-PS Płyta główna 2U Obudowa |
| Air Shroud | MCP-310-21703-0B | 4 | TwinPo 217HQ+/827HQ+ X10 plastic air shroud,RoHS/REACH |
| Backplane | BPN-SAS3-827HQ | 1 | 12-port 2U TwinPro^2 SAS3 CSE-827HQ (3 drives per node) backplane, support up to 12x 3.5-inch SAS3/SATA3 HDD |
| Backplane | BPN-ADP-S3008L-L6IP | 4 | LSI 3008, SAS 12Gbs (X6 port inside) |
| Cable 1 | CBL-PWCD-0578 | 2 | PWCD,US,IEC60320 C14 TO C13,3FT,14AWG |
| Label | LBL-0108 | 1 | CAUTION LABEL FOR REDUNDANT PWR SYSTEMS |
| Riser Card | RSC-P-6 | 4 | RSC-P-6 (1U LHS TwinPro RSC with 1 PCI-Ex16),RoHS |
| Riser Card | RSC-R1UTP-E16R | 4 | 1U RHS TwinPro Riser card with one PCI-E x16 slot |
| Heatsink / Retention | SNK-P0047PSM | 4 | 1U Passive Front CPU Heat Sink w/ a Middle Air Channel for X9, X10 2U Twin^2+ and Twin Pro^2 Series Servers |
| Heatsink / Retention | SNK-P0057PS | 4 | 1U High Performance Passive CPU Heat Sink for X9, X10 Systems Equipped w/ a Narrow ILM MB |
| Zasilacz | PWS-2K04A-1R | 2 | AC-DC 2000W, Titanium Level, Redundancy, 1U, PMBus 1.2, +12V/+5Vsb, 360x76x40mm,HF,RoHS/REACH |
| Air Shroud | MCP-310-21703-0B or MCP-310-21702-0B |
4 | TwinPro 217HQ+/827HQ+ X10 plastic air shroud or TwinPro 217HQ+/827HQ+ X10 mylay air shroud |
| Zasilacz | PWS-2K04A-1R | 2 | 2000W Redundant Titanium Level Power Supplies |