MBD-X11DPi-NT- Supermicro

Znajdź w sklepie Bizserver Opis:

2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
Intel® C622
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz
Or 2TB DCPMM, DDR4-2666MHz, in 16 DIMM slots;Up to 2TB Intel® Optane DC Persistent Memory in memory mode (Cascade Lake only);
4 PCI-E 3.0 x16,
2 PCI-E 3.0 x8
M.2 Interface: PCI-E 3.0 x4
M.2 Form Factor: 2260, 2280, 22110
M.2 Key: M-Key,
2 PCI-E 3.0 NVMe x4 Internal Port(s)
1 VGA port
Intel® C622 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
Dual LAN with 10GBase-T with Intel® X722 + X557

Specyfikacja

Ogólne

Producent:

Supermicro

Nazwa:

X11DPi-NT

Procesor

Procesor:

2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP) Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported CPU TDP support Up to 205W TDP 2 UPI up to 10.4 GT/s

Rdzenie:

Up to 28 cores

Uwagi:

BIOS version 3.0a or above is required to support 2nd Generation Intel Xeon Scalable Processors-SP

Pamięć

Pojemność pamięci:

Up to 4TB 3DS ECC RDIMM DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM DDR4-2933MHz Or 2TB DCPMM DDR4-2666MHz in 16 DIMM slots;Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);

Typ pamięci:

2933/2666/2400/2133MHz ECC DDR4 RDIMM LRDIMM

Rozmiary DIMM:

RDIMM: 64GBLRDIMM: 128GB3DS LRDIMM: 256GB

Napięcie:

1.2V

Specyfikacja płyty

Chipset:

Intel® C622

SATA:

Intel® C622 controller for 14 SATA3 (6 Gbps) ports; RAID 01510

Łączność sieciowa:

Dual LAN with 10GBase-T with Intel® X722 + X557

USB:

4 USB 2.0 ports (2 rear + 2 headers)5 USB 3.0 ports (2 rear + 2 headers + 1 Type A)

Grafika:

Aspeed AST2500 BMC

Video:

1 VGA port

SATA:

14 SATA3 (6Gbps) port

TPM:

1 TPM Header

Specyfikacja BIOSu

Typ BIOSu:

AMI UEFI

Oprogramowanie

Oprogramowanie:

Intel® Node Manager IPMI2.0 KVM with dedicated LAN SPM SSM SUM SuperDoctor® 5 Watchdog

Obudowa serwerowa

Rodzaj obudowy:

E-ATX

Wymiary:

12" x 13" (30.48cm x 33.02cm)

Monitorowanie stanu PC

LED:

CPU / System Overheat LED UID/Remote UID BMC/IPMI Heartbeat LED Power LED

Inne cechy:

ACPI power management ATX Power connector Chassis intrusion detection Chassis intrusion header Control of power-on for recovery from AC power loss CPU thermal trip support for processor protection NCSI header Node Manager Support RoHS SDDC UID

Napięcie:

+12V +3.3V +5V +5V standby 3.3V standby Monitors CPU voltages

Chłodzenie

Wentylatory:

8x 4-pin fan headers (up to 8 fans) PWM fan speed control

Temperatura:

CPU thermal trip support Monitoring for CPU and chassis environment PECI

Lista podzespołów

Parts List (Bulk Package)
Name	Part Number	Ile	Opis
Płyta główna	MBD-X11DPi-NT	1	X11DPi-NT Płyta główna
I/O Cables	CBL-0044L	2	57.5 cm SATA FLAT S-S PBF
I/O Shield	MCP-260-00042-0N	1	STD I/O SHIELD
Parts List (Retail Package)
Name	Part Number	Ile	Opis
Płyta główna	MBD-X11DPi-NT	1	X11DPi-NT Płyta główna
Quick Reference Guide	MNL-1773-QRG	1
I/O Cables	CBL-0476L	1	IPASS to 4 SATA cable
I/O Cables	CBL-0044L	2	57.5 cm SATA FLAT S-S PBF
I/O Shield	MCP-260-00042-0N	1	STD I/O SHIELD
Optional Parts List
Name	Part Number	Ile	Opis
TPM security module (optional, not included)	AOM-TPM-9670V-S		SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor
TPM security module (optional, not included)	AOM-TPM-9670H-S		SPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor
TPM security module (optional, not included)	AOM-TPM-9671V-S		SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor
TPM security module (optional, not included)	AOM-TPM-9671H-S		SPI capable TPM 1.2 with Infineon 9670 controller with horizontal form factor