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Opis:
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W TDP
Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots;Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
Intel® C622 chipset
Expansion slots: 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 (in x8)
2 10G SFP+
12 SATA3 (6Gbps) via C622
Supports 12V DC power input
I/O: 1 VGA, 2 COM, 1 TPM header
5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)
M.2 NGFF connector
M.2 Interface: PCI-E 3.0 x4
Form Factor: 2242, 2280
Key: M-Key
Double Height Connector