MBD-X11SPi-TF- Supermicro

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2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 205W
Intel® C622
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
Expansion slots:
1 PCI-E 3.0 x16,
1 PCI-E 3.0 x16 (x16 || x8),
1 PCI-E 3.0 x8 (x0 || x8),
1 PCI-E 3.0 x8,
1 PCI-E 3.0 x4 (in x8)
2 10GbE LAN ports
10 SATA3 (6Gbps) via C622
I/O: 1 VGA, 2 COM, TPM header
5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)
M.2 NGFF connector
M.2 Interface: PCI-E 3.0 x4 and SATA
Form Factor: 2280, 22110
Key: M-Key
Double Height Connector

Specyfikacja

Ogólne

Producent:

Supermicro

Nazwa:

X11SPi-TF

Procesor

Procesor:

2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP) Intel® Xeon® Scalable Processors.Single Socket P (LGA 3647) supported CPU TDP support 205W

Rdzenie:

Up to 28 cores

Uwagi:

BIOS version 3.0a or above is required to support 2nd Generation Intel Xeon Scalable Processors-SP

Pamięć

Pojemność pamięci:

Up to 2TB 3DS ECC RDIMM DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM DDR4-2933MHz in 8 DIMM slots

Typ pamięci:

2933/2666/2400/2133MHz ECC DDR4 RDIMM LRDIMM

Rozmiary DIMM:

RDIMM: 8GB 16GB 32GB 64GBLRDIMM: 32GB 64GB 128GB3DS LRDIMM: 64GB 128GB 256GB

Napięcie:

1.2V

Specyfikacja płyty

Chipset:

Intel® C622

SATA:

Intel® C622 controller for 10 SATA3 (6 Gbps) ports; RAID 01510

Łączność sieciowa:

Dual LAN with 10GBase-T with Intel® X722 + X557

USB:

6 USB 2.0 ports (2 rear + 4 headers)5 USB 3.0 ports (2 rear + 2 headers + 1 Type A)

Grafika:

Aspeed AST2500 BMC

LAN:

2 RJ45 10GBase-T ports

Video:

1 VGA port

SATA:

10 SATA3 (6Gbps) port

TPM:

TPM Header

Specyfikacja BIOSu

Typ BIOSu:

AMI UEFI

Oprogramowanie

Oprogramowanie:

Intel® Node Manager IPMI2.0 KVM with dedicated LAN NMI SPM SUM SuperDoctor® 5 Watchdog

Obudowa serwerowa

Rodzaj obudowy:

ATX

Wymiary:

12" x 9.6" (30.48cm x 24.38cm)

Monitorowanie stanu PC

LED:

CPU / System Overheat LED UID/Remote UID Suspend static indicator LED

Inne cechy:

ACPI power management Control of power-on for recovery from AC power loss CPU thermal trip support for processor protection M.2 NGFF connector RoHS UID WOL

Napięcie:

+1.8V +12V +3.3V +5V +5V standby 3.3V standby 7-fan status Chassis intrusion header HT Monitors CPU voltages Supports system management utility VBAT

Chłodzenie

Wentylatory:

7x 4-pin fan headers (up to 7 fans) Fan speed control Overheat LED indication PWM fan speed control System level control

Temperatura:

CPU thermal trip support PECI

Lista podzespołów

Parts List (Bulk Package)
Name	Part Number	Ile	Opis
Płyta główna	MBD-X11SPi-TF	1	X11SPi-TF Płyta główna
I/O Cables	CBL-0044L	2	57.5 cm SATA FLAT S-S PBF
I/O Shield	MCP-260-00042-0N	1	STD I/O Shield for X11SPi-TF with EMI Gasket
Parts List (Retail Package)
Name	Part Number	Ile	Opis
Płyta główna	MBD-X11SPi-TF	1	X11SPi-TF Płyta główna
QRG	MNL-1900-QRG	1	Płyta główna Quick Reference Guide
I/O Cables	CBL-0044L	6	57.5 cm SATA FLAT S-S PBF
I/O Shield	MCP-260-00042-0N	1	STD I/O Shield for X11SPi-TF with EMI Gasket
Optional Parts List
Name	Part Number	Ile	Opis
TPM security module	AOM-TPM-9670H		SPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor
TPM security module	AOM-TPM-9670V		SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor
TPM security module	AOM-TPM-9671H		SPI capable TPM 1.2 with Infineon 9670 controller with horizontal form factor
TPM security module	AOM-TPM-9671V		SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor