MBD-X11SPH-nCTPF- Supermicro
Znajdź w sklepie Bizserver
Opis:
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support Up to 205W TDP
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
Intel® C622 chipset
Expansion slots:
1 PCI-E 3.0 x16 (x16 || x8),
1 PCI-E 3.0 x8 (x0 || x8),
1 PCI-E 3.0 x8,
1 PCI-E 3.0 x4 (in x8)
2 10G SFP+
10 SATA3 (6Gbps) via C622
8 SAS3 (12Gbps) via Broadcom® 3008; RAID 0, 1, 10
2x Port NVMe PCI-E 3.0 x4 via OCuLink
5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers)
M.2 NGFF connector
M.2 Interface: PCI-E 3.0 x4 and SATA
Form Factor: 2280
Key: M-Key
Double Height Connector
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support Up to 205W TDP
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
Intel® C622 chipset
Expansion slots:
1 PCI-E 3.0 x16 (x16 || x8),
1 PCI-E 3.0 x8 (x0 || x8),
1 PCI-E 3.0 x8,
1 PCI-E 3.0 x4 (in x8)
2 10G SFP+
10 SATA3 (6Gbps) via C622
8 SAS3 (12Gbps) via Broadcom® 3008; RAID 0, 1, 10
2x Port NVMe PCI-E 3.0 x4 via OCuLink
5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers)
M.2 NGFF connector
M.2 Interface: PCI-E 3.0 x4 and SATA
Form Factor: 2280
Key: M-Key
Double Height Connector
Specyfikacja
Ogólne
Producent:
Supermicro
Nazwa:
X11SPH-nCTPF
Procesor
Procesor:
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP) Intel® Xeon® Scalable Processors.Single Socket P (LGA 3647) supported CPU TDP support Up to 205W TDP
Rdzenie:
Up to 28 cores
Uwagi:
BIOS version 3.0a or above is required to support 2nd Generation Intel Xeon Scalable Processors-SP
Pamięć
Pojemność pamięci:
Up to 2TB 3DS ECC RDIMM DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM DDR4-2933MHz in 8 DIMM slots
Typ pamięci:
2933/2666/2400/2133MHz ECC DDR4 RDIMM LRDIMM
Rozmiary DIMM:
RDIMM: 8GB 16GB 32GB 64GBLRDIMM: 32GB 64GB 128GB3DS LRDIMM: 64GB 128GB 256GB
Napięcie:
1.2V
Specyfikacja płyty
Chipset:
Intel® C622
SATA:
Intel® C622 controller for 10 SATA3 (6 Gbps) ports; RAID 01510Broadcom® 3008 SW controller for 8 SAS3 (12Gbs) ports; RAID 0110
Łączność sieciowa:
Dual LAN with 10G SFP+ with Intel® X722 + Inphi CS4227
USB:
8 USB 2.0 ports (2 rear + 6 headers)5 USB 3.0 ports (2 rear + 2 headers + 1 Type A)
Grafika:
Aspeed AST2500 BMC
LAN:
2 10G SFP+ LAN ports
Video:
1 VGA port
SATA:
10 SATA3 (6Gbps) port
TPM:
TPM Header
Specyfikacja BIOSu
Typ BIOSu:
AMI UEFI
Oprogramowanie
Oprogramowanie:
Obudowa serwerowa
Rodzaj obudowy:
ATX
Wymiary:
12" x 9.6" (30.48cm x 24.38cm)
Monitorowanie stanu PC
LED:
CPU / System Overheat LED UID/Remote UID Suspend static indicator LED
Inne cechy:
N/A
Napięcie:
N/A
Chłodzenie
Wentylatory:
8x 4-pin fan headers (up to 8 fans)
Temperatura:
CPU thermal trip support PECI
Lista podzespołów
| Parts List (Bulk Package) | |||
| Name | Part Number | Ile | Opis |
| Płyta główna | MBD-X11SPH-nCTPF | 1 | X11SPH-nCTPF Płyta główna |
| I/O Cables | CBL-0044L | 2 | 57.5 cm SATA FLAT S-S PBF |
| I/O Shield | MCP-260-00109-0N | 1 | STD I/O Shield for X11SPH-nCTPF with EMI Gasket |
| Parts List (Retail Package) | |||
| Name | Part Number | Ile | Opis |
| Płyta główna | MBD-X11SPH-nCTPF | 1 | X11SPH-nCTPF Płyta główna |
| QRG | MNL-1949-QRG | 1 | Płyta główna Quick Reference Guide |
| I/O Cables | CBL-0044L | 2 | 57.5 cm SATA FLAT S-S PBF |
| I/O Shield | MCP-260-00109-0N | 1 | STD I/O Shield for X11SPH-nCTPF with EMI Gasket |
| Optional Parts List | |||
| Name | Part Number | Ile | Opis |
| 1U I/O Shield | MCP-260-00114-0N | 1 | 1U I/O Shield for X11SPH-nCTPF with EMI Gasket |
Linki i zasoby
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