MBD-X11DSF-E- Supermicro
Znajdź w sklepie Bizserver
Opis:
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C627
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;Up to 6TB Intel® Optane DC Persistent Memory in memory mode (Cascade Lake only)
1 PCI-E 3.0 x32 Left Riser Slot,
2 PCI-E 3.0 x4 (Low Profile),
4 PCI-E 3.0 x16
1 VGA D-Sub Connector port
Intel® C627 controller for 8 SATA3 (6 Gbps) ports; RAID 0,1,5,10
Dual LAN with 10GBase-T with Intel® X550
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C627
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;Up to 6TB Intel® Optane DC Persistent Memory in memory mode (Cascade Lake only)
1 PCI-E 3.0 x32 Left Riser Slot,
2 PCI-E 3.0 x4 (Low Profile),
4 PCI-E 3.0 x16
1 VGA D-Sub Connector port
Intel® C627 controller for 8 SATA3 (6 Gbps) ports; RAID 0,1,5,10
Dual LAN with 10GBase-T with Intel® X550
Specyfikacja
Ogólne
Producent:
Supermicro
Nazwa:
X11DSF-E (For SuperServer Only)
Procesor
Procesor:
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP) Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported CPU TDP support 205W TDP 3 UPI up to 10.4 GT/s
Uwagi:
*2933 MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro
Pamięć
Pojemność pamięci:
Up to 6TB 3DS ECC RDIMM DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM DDR4-2933MHz in 24 DIMM slots;Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
Typ pamięci:
2666/2400/2133MHz ECC DDR4 RDIMM LRDIMM
Rozmiary DIMM:
RDIMM: 32GB 64GB 128GBLRDIMM: 64GB 128GB3DS LRDIMM: 128GB 256GB
Napięcie:
1.2V
Specyfikacja płyty
Chipset:
Intel® C627
SATA:
Intel® C627 controller for 8 SATA3 (6 Gbps) ports; RAID 01510
Łączność sieciowa:
Dual LAN with 10GBase-T with Intel® X550
USB:
5 USB 3.0 ports (2 rear + 2 headers + 1 Type A)
Video:
1 VGA D-Sub Connector port
TPM:
1 TPM Header
Specyfikacja BIOSu
Typ BIOSu:
AMI UEFI
Oprogramowanie
Oprogramowanie:
Intel® Node Manager IPMI (Intelligent Platform Management Interface) v2.0 with KVM support IPMI2.0 KVM with dedicated LAN NMI SPM SSM SUM SuperDoctor® 5 Watchdog
Obudowa serwerowa
Rodzaj obudowy:
Proprietary
Wymiary:
16.337" x 17" (41.5cm x 43.18cm)
Monitorowanie stanu PC
LED:
CPU / System Overheat LED UID/Remote UID
Inne cechy:
Chassis intrusion detection Chassis intrusion header Control of power-on for recovery from AC power loss CPU thermal trip support for processor protection Innovation Engine Intel® QuickAssist Technology Node Manager Support RoHS RoHS Halogen Free System level control UID WOL
Napięcie:
+1.5V +1.8V +12V +3.3V +5V +5V standby Chipset Voltage Memory Voltages Monitors CPU voltages VBAT
Chłodzenie
Wentylatory:
8x 4-pin fan headers (up to 8 fans) 8x fans with tachometer monitoring Fan speed control Overheat LED indication Pulse Width Modulated (PWM) fan connectors
Temperatura:
N/A
Lista podzespołów
| Parts List (Bulk Package) | |||
| Name | Part Number | ||
| Płyta główna | MBD-X11DSF-E | 1 | X11DSF-E Płyta główna |
| -- | |||
Linki i zasoby
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