MBD-X10DDW-i- Supermicro

Zdjecie - MBD-X10DDW-i- Supermicro
Znajdź w sklepie Bizserver Opis:
 
Dual socket R3 (LGA 2011) supports
Intel® Xeon® processor E5-2600
v4†/ v3 family; UPI up to 9.6GT/s
Intel® C612 chipset
Up to 2TB† ECC 3DS LRDIMM , up to
DDR4- 2400†MHz; 16 DIMM slots
1 PCI-E 3.0 x32 Left riser slot 1 PCI-E 3.0 x8 Right riser slot 1 PCI-E 3.0 x8 for Add-On-Module
Intel® i350 Dual port GbE LAN
10 SATA3 (6Gbps); RAID 0, 1, 5, 10
Integrated IPMI 2.0 and KVM with
Dedicated LAN
3 USB 3.0 (2 rear, 1 Type A);
4 USB 2.0 (2 rear, 2 via header)

Specyfikacja

Ogólne

Producent:
Supermicro
Nazwa:
X10DDW-i

Procesor

Procesor:
Intel® Xeon® processor E5-2600 v3 Intel® Xeon® processor E5-2600 v4.Dual Socket R3 (LGA 2011) supported CPU TDP support Up to 160W 1 QPI up to 9.6GT/s
Rdzenie:
Up to 22 cores † / Up to 55MB† cache
Uwagi:
† BIOS version 2.0 or above is required ** Motherboard supports this maximum TDP. Please verify your system can thermally support.

Pamięć

Pojemność pamięci:
Up to 1TB Registered ECC RDIMM DDR4-2400MHz; Up to 2TB 3DS ECC LRDIMM DDR4-2400MHz in 16 DIMM slots
Typ pamięci:
2400†/2133/1866/1600MHz ECC DDR4 SDRAM 72-bit
Rozmiary DIMM:
RDIMM: 4GB 8GB 16GB 32GB 64GBLRDIMM: 32GB 64GB3DS LRDIMM: 128GB
Napięcie:
1.2V

Specyfikacja płyty

Chipset:
Intel® C226 Express PCH
SATA:
SATA3 (6Gbps); RAID 0 1 5 10 SATA3 (6Gbps); RAID 0 1 5 10
Łączność sieciowa:
Dual LAN with Intel® i350 Gigabit Ethernet Controller
Single LAN with Virtual Machine Device Queues reduce I/O overhead
Single LAN with Supports 10Base-T 100BASE-TX and 1000BASE-T RJ45 output
Single LAN with Realtek RTL8111E Gigabit Ethernet
USB:
4 USB 2.0 ports (2 rear + 2 headers)3 USB 3.0 ports (2 rear + 1 Type A)
Grafika:
Aspeed AST2400 BMC
LAN:
2 RJ45 Gigabit Ethernet LAN ports1 RJ45 Dedicated IPMI LAN port
Video:
1 VGA port
SATA:
10 SATA3 (6Gbps) port
TPM:
1 TPM Header

Specyfikacja BIOSu

Typ BIOSu:
128Mb SPI Flash EEPROM with AMI BIOS

Oprogramowanie

Oprogramowanie:
Intel® Node Manager IPMI2.0 NMI SPM SUM Watchdog

Obudowa serwerowa

Rodzaj obudowy:
Proprietary WIO
Wymiary:
12" x 9.6" (30.48cm x 24.4cm)

Monitorowanie stanu PC

LED:
CPU / System Overheat LED Suspend static indicator LED UID/Remote UID
Inne cechy:
Chassis intrusion detection Chassis intrusion header RoHS SDDC
Napięcie:
+1.8V +12V +3.3V +5V +5V standby 3.3V standby 5 Phase-switching voltage regulator Memory Voltages VBAT

Chłodzenie

Wentylatory:
6x 4-pin fan headers (up to 6 fans) 6 fans with tachometer status monitoring Pulse Width Modulated (PWM) fan connectors Status monitoring for speed control
Temperatura:
Monitoring for CPU and chassis environment CPU thermal trip support Thermal Monitor 2 (TM2) support PECI Thermal Control for 6 Fan Connectors

Lista podzespołów

Parts List (Bulk Package)
Name Part Number Ile Opis
Płyta główna MBD-X10DDW-i 1 X10DDW-i Płyta główna
Parts List (Retail Package)
Name Part Number Ile Opis
X10DDW-iMBD-X10DDW-i1X10DDW-i Płyta główna
I/O CablesCBL-SAST-06442RA IPASS TO 4 SATA, 75/75/90/90cm w/90cm SB, 30AWG
Quick Reference GuideMNL-1572-QRG1Quick Reference Guide
Optional Parts List
Name Part Number Ile Opis
TPM security module (optional, not included)AOM-TPM-9655VLPC capable TPM 1.2 with Infineon 9655 controller with verticle form factor
TPM security module (optional, not included)AOM-TPM-9655HLPC capable TPM 1.2 with Infineon 9655 controller with horizontal form factor
TPM security module (optional, not included)AOM-TPM-9665VLPC capable TPM 2.0 with Infineon 9665 controller with verticle form factor
TPM security module (optional, not included)AOM-TPM-9665HLPC capable TPM 2.0 with Infineon 9665 controller with horizontal form factor
Add-on Module S3108AOM-S3108M-H8Broadcom® 3108, SS-3/Gen-3 12Gb/ROC

Linki i zasoby