MBD-X10OBI-CPU- Supermicro
Znajdź w sklepie Bizserver
Opis:
Intel® Xeon® processor E7-8800 v3, Intel® Xeon® processor E7-8800 v4.Octal Socket LGA-2011 (Socket R) supported, CPU TDP support Up to 165W TDP, 3 QPI up to 9.6GT/s
Intel® C602J
Up to 3TB 3DS ECC RDIMM, DDR4-1866MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-1866MHz, in 24 DIMM slots; LRDIMM and RDIMM support up to 3TB with 128GB DIMM size
1 PCI-E 3.0 x16,
1 PCI-E 3.0 x8
U.2 Interface: 2 PCI-E 3.0 x4,
2 PCI-E 3.0 NVMe x4
(on PCH board)
(on Storage board)
Quad LAN with Patsburg-J Chipset(on PCH board)
Intel® Xeon® processor E7-8800 v3, Intel® Xeon® processor E7-8800 v4.Octal Socket LGA-2011 (Socket R) supported, CPU TDP support Up to 165W TDP, 3 QPI up to 9.6GT/s
Intel® C602J
Up to 3TB 3DS ECC RDIMM, DDR4-1866MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-1866MHz, in 24 DIMM slots; LRDIMM and RDIMM support up to 3TB with 128GB DIMM size
1 PCI-E 3.0 x16,
1 PCI-E 3.0 x8
U.2 Interface: 2 PCI-E 3.0 x4,
2 PCI-E 3.0 NVMe x4
(on PCH board)
(on Storage board)
Quad LAN with Patsburg-J Chipset(on PCH board)
Specyfikacja
Ogólne
Producent:
Supermicro
Nazwa:
X10OBI-CPU (For SuperServer Only)
Procesor
Procesor:
Intel® Xeon® processor E7-8800 v3 Intel® Xeon® processor E7-8800 v4.Octal Socket LGA-2011 (Socket R) supported CPU TDP support Up to 165W TDP 3 QPI up to 9.6GT/s
Pamięć
Pojemność pamięci:
Up to 3TB 3DS ECC RDIMM DDR4-1866MHz; Up to 3TB 3DS ECC LRDIMM DDR4-1866MHz in 24 DIMM slots; LRDIMM and RDIMM support up to 3TB with 128GB DIMM size
Typ pamięci:
1866/1600/1333/1066/800MHz ECC DDR4 SDRAM 72-bit 288-pin gold-plated DIMMs
Rozmiary DIMM:
RDIMM: 8GB 16GB 32GB 64GB 128GBLRDIMM: 8GB 16GB 32GB 64GB 128GB3DS LRDIMM: 16GB 32GB 64GB 128GB
Napięcie:
1.2V
Specyfikacja płyty
Chipset:
Intel® C602J
SATA:
(on Storage board)
Łączność sieciowa:
Quad LAN with Patsburg-J Chipset(on PCH board)
USB:
(on PCH board)
Grafika:
(on PCH board)
Video:
(on PCH board)
Inne:
(TPM header on PCH board)
Specyfikacja BIOSu
Typ BIOSu:
AMI UEFI
Oprogramowanie
Oprogramowanie:
IPMI (Intelligent Platform Management Interface) v2.0 with KVM support
Obudowa serwerowa
Rodzaj obudowy:
Proprietary
Wymiary:
11.07" x 20.17" (28.12cm x 51.23cm)
Monitorowanie stanu PC
LED:
CPU / System Overheat LED Memory DIMM ECC error LEDs
Inne cechy:
4x 8-pin GPU power connectors RoHS RoHS Halogen Free SDDC
Napięcie:
+1.5V +12V +3.3V(on PCH board)
Chłodzenie
Wentylatory:
8x 4-pin fan headers (up to 8 fans) 8x fans with tachometer monitoring(on BPN-X10OBi board)
Temperatura:
Thermal Monitor 2 (TM2) support
Lista podzespołów
| Parts List (Bulk Package) | |||
| Name | Part Number | ||
| Płyta główna | MBD-X10OBI-CPU | 1 | X10OBI-CPU Płyta główna |
| -- | |||
Linki i zasoby
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