SuperServer 6029P-TR - Supermicro
Znajdź w sklepie Bizserver
Opis:
Cloud and Virtualization needs Compute Intensive Application Database Processing and Storage High Availability Storage Hosting & Application Delivery
1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡
2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††
3. 4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8 slots
4. 8 Hot-swap 3.5" SATA3 drive bays; RAID 0, 1, 5, 10
5. Optional DVD-ROM drive, optional support: 2 fixed 2.5" NVMe/SSD/HDD, 1 M.2 support
6. M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2260, 2280, 22110 M.2 Key: M-Key
7. 2x 1GbE LAN ports with Intel® X722
8. 1000W Redundant Power Supplies Titanium Level (96% efficiency)
Cloud and Virtualization needs Compute Intensive Application Database Processing and Storage High Availability Storage Hosting & Application Delivery
1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡
2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††
3. 4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8 slots
4. 8 Hot-swap 3.5" SATA3 drive bays; RAID 0, 1, 5, 10
5. Optional DVD-ROM drive, optional support: 2 fixed 2.5" NVMe/SSD/HDD, 1 M.2 support
6. M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2260, 2280, 22110 M.2 Key: M-Key
7. 2x 1GbE LAN ports with Intel® X722
8. 1000W Redundant Power Supplies Titanium Level (96% efficiency)
Specyfikacja
Ogólne
Producent:
Supermicro
Nazwa:
SuperServer 6029P-TR (Black)
Płyta główna:
Super X11DPi-N
Procesor
Procesor:
Dual Socket P (LGA 3647)
2nd Gen. Intel® Xeon® Scalable Processors (Cascade Lake/Skylake)‡Dual UPI up to 10.4GT/s
Support CPU TDP 70-205W
2nd Gen. Intel® Xeon® Scalable Processors (Cascade Lake/Skylake)‡Dual UPI up to 10.4GT/s
Support CPU TDP 70-205W
Rdzenie:
Up to 28 Cores
Pamięć
Pojemność pamięci:
16 DIMM slots
Up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM
Supports Intel® Optane™ DCPMM††
Up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM
Supports Intel® Optane™ DCPMM††
Typ pamięci:
2933†/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
Specyfikacja płyty
Chipset:
Intel® C621 chipset
SATA:
SATA3 (6Gbps); RAID 0 1 5 10
IPMI:
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
USB:
Rear USB: 2 USB 3.0 + 2 USB 2.0
Front USB: 2 USB 2.0
USB Header: 1 Type A
Front USB: 2 USB 2.0
USB Header: 1 Type A
Grafika:
ASPEED AST2500 BMC
LAN:
2 RJ45 Gigabit Ethernet LAN ports
1 RJ45 Dedicated IPMI LAN port
1 RJ45 Dedicated IPMI LAN port
Port szeregowy:
2 Fast UART 16550 serial
2 COM Ports (1 rear 1 header)
2 COM Ports (1 rear 1 header)
PCI-Express:
4 PCI-E 3.0 x16 (Low-profile)
2 PCI-E 3.0 x8 (Low-profile)
2 PCI-E 3.0 x8 (Low-profile)
Specyfikacja BIOSu
Typ BIOSu:
AMI UEFI
Oprogramowanie
Oprogramowanie:
Intel® Node Manager
IPMI 2.0
KVM with dedicated LAN
SSM SPM SUM
SuperDoctor® 5
Watch Dog
IPMI 2.0
KVM with dedicated LAN
SSM SPM SUM
SuperDoctor® 5
Watch Dog
Obudowa serwerowa
Rodzaj obudowy:
2U Rackmount
Model obudowy:
CSE-825TQC-R1K03LPB
Wymiary
Wysokość:
3.5" (89mm)
Szerokość:
17.2" (437mm)
Długość:
25.5" (647mm)
Waga:
Net Weight: 35.5 lbs (16.1 kg)
Gross Weight: 69 lbs (31.2 kg)
Gross Weight: 69 lbs (31.2 kg)
Panel Przedni
Panel przedni - przyciski:
Power On/Off button
System Reset button
UID button
System Reset button
UID button
Panel przedni - LEDy:
Power status LED
HDD activity LED
Network activity LEDs
System information (overheat/UID) LED
HDD activity LED
Network activity LEDs
System information (overheat/UID) LED
Chłodzenie
Wentylatory:
3 Heavy duty 80mm fans with PWM fan speed control
Zasilanie
Konfiguracja mocy:
ACPI / APM Power Management
Wejście AC:
100-127Vac / 12-9A / 50-60Hz
200-240Vac / 7.2-6A / 50-60Hz
200-240Vdc / 7.2-6A (for CCC only)
200-240Vac / 7.2-6A / 50-60Hz
200-240Vdc / 7.2-6A (for CCC only)
+12V:
Max: 66.7A / Min. 0A (100-127Vac)
Max: 83A / Min. 0A (200-240Vac)
Max: 83A / Min. 0A (200-240Vdc)
Max: 83A / Min. 0A (200-240Vac)
Max: 83A / Min. 0A (200-240Vdc)
Środowisko Operacyjne
RoHS:
RoHS Compliant
Specyfikacja środowiskowa:
Operating Temperature:
10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
Lista podzespołów
| Parts List - (Items Included) | |||
| |
Part Number |
Ile |
Opis |
| Płyta główna / Obudowa | MBD-X11DPi-N CSE-825TQC-R1K03LPB |
1 1 |
Super X11DPi-N Płyta główna 2U Obudowa |
| Backplane | BPN-SAS3-825TQ | 1 | 8-port 2U SAS3 12Gbps TQ backplane, support up to 8x 3.5-inch SAS3/SATA3 HDD/SSD |
| Cable 1 | CBL-0343L-01 | 2 | MINI SAS-4 SATA,INT,76/66/54/45CM,66CM SB,30AWG |
| Drive Tray(s) | MCP-220-00007-01 | 1 | Black USB/COM port tray for SC825, 836 |
| Parts | MCP-260-00042-0N | 1 | STD I/O shield for X9 socket R server MB with Gasket. |
| Manual | MNL-1918-QRG | 1 | 6029P-TR/TRT Quick Reference Guide |
| Heatsink / Retention | SNK-P0068PS | 1 | 2U Passive CPU Heat Sink for X11 Purley Platform Equipped with a Narrow Retention Mechanism |
| Heatsink / Retention | SNK-P0068PSC | 1 | 2U Passive CPU Heat Sink with a Side Air Channel for X11 Purley Platform Equipped with a Narrow Retention Mechanism |
| Zasilacz | PWS-1K03A-1R | 2 | 1U 1000W Redundant Zasilacz Titanium W/PMbus 76x40x336mm,RoHS/REACH |
| FAN 1 | FAN-0181L4 | 3 | 80x80x38 mm, 9.4K RPM, Hot-swappable Middle Cooling Fan for X11 Purley Platform Newly Enabled 2U+ Obudowa |